Keysight Technologies Inc. announced it will demonstrate its latest RF circuit, system and 3D electromagnetic design and simulation solutions at the Compound Semiconductor IC Symposium (CSICS 2014), Hyatt Regency La Jolla at Aventine, San Diego, California, Oct. 19-22. Keysight EEsof EDA is a silver-level sponsor of the event.

The symposium brings together industry experts from around the world to discuss and present the latest results in GaAs IC technology and monolithic microwave integrated circuit design as well as GaN, InP, SiGe, nanoscale CMOS, and other emerging technologies. CSICS offers the ideal forum for discussing state-of-the-art IC performance, innovative design techniques and advanced device technologies. No other event presents GaN HPAs, InP THz PAs, 100 Gb/s CMOS/SiGe transceivers, GaN HEMT power devices, and advances in compact modeling alongside one another.

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Keysight Technologies Inc.

During CSICS 2014, Keysight’s technical experts and application engineers will demonstrate the latest releases of its leading electronic design automation software for RF, microwave, high frequency, high-speed digital RF system, electronic system level, circuit, 3-D electromagnetic, physical design, and device-modeling applications.

Specific demonstrations will include:

  • Advanced Design System and its new Electro-Thermal Simulator, Doherty and envelope tracking applications, and GaAs, GaN, Silicon RFIC, and multi-technology RF module design capabilities.
  • EMPro with 3D electromagnetic components and unparalleled integration with ADS. EMPRO provides time- and frequency-domain simulation technologies allowing it to handle a broad range of RF, microwave and high-speed digital applications.
  • Modeling and characterization of CMOS and III-V devices for cutting-edge logic, AMS and RF technologies using an end-to-end platform that provides an open, user-programmable environment with built-in, turn-key solutions for wafer-level automated measurement and modeling of semiconductor devices.

 Keysight's senior RF module designer, Matthew Ozalas, will present a technical paper on October 22, titled, “The Impact of Electro-thermal Coupling on RF Power Amplifier Performance.” Additional information on the upcoming exhibition is available at www.csics.org.