Indium Corp. will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif.
NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer to eliminate the cleaning process.
NC-26-A controls wetting activity to better avoid two main soldering issues that plague manufacturing engineers: solder bridging and cold joints. NC-26-A also retains its bump height after reflow, reduces the UBM/bump crack caused by vibration in the cleaning process, and boasts a higher compatibility with capillary and molded underfills (CUF and MUF).
NC-26-A is designed for flip-chip dipping applications and has tackiness suitable for holding die in mass-reflow assembly processes. For more information on NC-26-A, visit www.indium.com/no-clean-flip-chip-fluxes or visit Indium Corporation at booth 217.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.