Several Indium Corp. technology experts will lead technical sessions at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.  

Tim Jensen, senior product manager for engineered solders, will co-chair session MFX7: "Lead-Free Alloys End Use-Application Reliability", which will review the formation of intermetallic compounds, as well as their impact on reliability, when using lead-free solder alloys. 

Glen Thomas, product manager for PCB assembly solder paste, will serve as session chair for SMT3: "PCB Component/Connector Rework-From Small to Large". This session will include a summary of recommended methods used to rework large and small PCB components and connectors for effective time and cost management. 

Eric Bastow, assistant technical manager, will serve as session chair for AAT7: "Fluxes, Standards and Contaminants Face Off with Reliability". This session will discuss the effects of contamination, as well as a variety of stressing environments and tests, on various fluxes. The session will finish with a summary and clarification of new aspects of IPC J-STD-004. 

SMTA International is an annual technical conference and exhibition on electronics assembly and advanced packaging that draws industry professionals from around the world. For a full schedule of sessions, visit www.smta.org/smtai. 

Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent more than 15 years working with customers troubleshooting and optimizing SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon, and foil, as well as thermal interface materials.

Thomas has more than 25 years of experience working with printed wiring boards and semiconductor packaging. He earned his bachelor’s degree in chemical engineering from the University of Wisconsin and his master’s degree, also in chemical engineering, from Michigan State University.

Bastow provides technical support for Indium Corporation’s full range of solder products for electronics assembly, semiconductor package assembly, and thermal management. He earned his associate’s degree in engineering science from the State University of New York in Herkimer and earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. Bastow is a certified IPC-A-600 and 610D specialist and SMTA-certified process engineer.

Indium Corp. is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corp. visit www.indium.com or email abrown@indium.com.