ANTENNAS
Enjiu, Rodrigo Kenji and Marcelo Bender Perotoni
“Slotted Waveguide Antenna Design Using 3D EM Simulation,” No. 7, p. 72.
Labowski, Kyle, Christopher Penney and James F. Stack, Jr.
“Conformal Antenna Array Design on a Missile Platform,” No. 1, p. 112.
Lam, Tom, Rich Bidwell and Scott Blee
“Spiral Antenna Design Consideration,” No. 1, p. 84.
Patton, Ruska and Ning Yang
“Verifying Very-Near-Field Antenna Measurements: Algorithm Evaluation,” No. 4, p. 94.
COMPONENTS/SUBSYSTEMS
Janeczek, Kamil, Malgorzata Jakubowska, Grazyna Koziol and Wojciech Steplewski
“Screen Printed RFID-Enabled Temperature Sensor Fabricated on Flexible Substrates,” No. 2, p. 102.
Morkner, Henrick and Alfred Riddle
“A Compact, Low Cost 10 MHz to 40 GHz Amplifier Module,” No. 4, p. 72.
Xue, W., Y.H. Zyang, Z.J. Feng and Y. Fan
“A Broadband Millimeter-Wave Rectangular-to-Coplanar Waveguide Transition,” No. 3, p. 94.
COVER FEATURES
Agilent, ANSYS, AWR, Cadence, COMSOL, CST, FEKO, IMST, Intercept Technologies, Mician, MiG, Remcom, Sonnet and Tech-X
“RF/Microwave Design Software Review,” No. 7, p. 22.
Brookner, Eli
“MIMO Radar: Demystified,” No. 1, p. 22.
Carson, Peter
“Less is More: The New Mobile RF Front-End,” No. 6, p. 24.
Chenakin, Alexander
“From a Russian Source,” No. 5, p. 26.
Eroglu, Abdullah
“RF Technology in Semiconductor Wafer Processing,” No. 12, p. 24
Higham, Eric
“CMOS Makes Waves in the Mobile Front-End,” No. 6, p. 22.
Meinel, Holger H. and Juergen Dickman
“Automotive Radar: From Its Origins to Future Directions,” No. 9, p. 24.
Pawling, Ben and Keith Olds
“Separating Fact from Fiction: HTS Ka- and Ku-Band for Mission Critical SATCOM,” No. 8, p. 22.
Rohde, Ulrich, Ajay Poddar and Anisha Apte
“Phase Noise Measurements and System Comparisons,” No. 4, p. 22.
Rohde, Ulrich L. and Ajay K. Poddar
“Printed Resonators: Möbius Strip Theory and Applications,” No. 11, p. 24.
Santori, Mike, Jean Dassonville, Phil Lorch and Dave Hutton
“Synthetic Instrumentation: The Future of Test,” No. 3, p. 22.
Vondran, David J.
“Making Connections Beyond 110 GHz,” No. 2, p. 22.
Vye, David
“Surviving Sequestration,” No. 10, p. 22.
DESIGN
Alsabbagh, Eid, Haoyang Yu and Kevin Gallagher
“802.11ac Design Considerations for Mobile Devices,” No. 2, p. 80.
Chengtian, Song, Zhang Xiangjun, Zhou Li and Ma Xiaoping
“Compact LTCC Two-Band Bandpass Filter Using Dual-Layer SIRs,” No. 5, p. 190.
Fields, Wes
“SP8T, 50 to 1000 MHz, 20 W Switch Design Using PIN Diodes in Plastic,” No. 9, p. 140.
Gorevoy, Andrew
“A Low Noise Oscillator Based on a Conventional Dielectric Resonator,” No. 11, p. 84.
Hall, David and Janne Roos
“Using Test Equipment to Extract Behavioral RF Device Models for Communications System Design,” No. 3, p. 70.
Ji, Lianqing, Zhiming Xu, Jianyi Zhou and Jianfeng Zhai
“Highly Efficient 10 W GaN Class F Power Amplifier Using DPD,” No. 10, p. 120.
Kang, In-Ho and Xin Guan
“Miniaturized Microstrip Balun Filter,” No. 10, p. 132.
Kim, Hyungchul, Hanjin Cho, Min-Su Kim, Mincheol Seo, Junghyun Ham, Cheon-Seok Park, Youngoo Yang, Yao Xi and Sungchan Jung
“Efficiency Enhanced Amplifier Using a Digitally-Controlled Bias Switching Circuit,” No. 5, p. 106.
Krishnamurthi, Kathiravan, Zhiuang Liu and Ian Gresham
“Design of Linear SiGe IC Downconverters,” No. 3, p. 78.
Leng, Yong-Qing, Yun Zeng, Guo-Liang Zhang, Wei Peng, Li-Jun Zhang, Ya-Tao Peng, Jin Guan, Hui Lu and Zhan-Qi Zheng
“An Inverse Class E Power Amplifier with Finite DC-Feed Inductance,” No. 8, p. 86.
Liu, Haiwen, Jiuhuai Lei, Yulong Zhao and Wenyuan Xu
“Compact Triple-Band Bandpass Filter With Multimode Resonator,” No. 6, p. 84.
Liu, Haiwen, Xiaomei Wang, Yulong Zhao, Yan Wang, Baoping Ren, Jiuhuai Lei and Shan Wang
“Compact Tri-Band Bandpass Filter Using Short-Circuited Stub-Loaded SIR,” No. 5, p. 122.
Pan, T., K. Song and Y. Fan
“Wide Stopband Bandpass Filter Based on Composite Right/Left Handed Transmission Line,” No. 6, p. 92.
Poddar, Ajay K. and Ulrich L. Rohde
“Technique to Minimize Phase Noise of Crystal Oscillators,” No. 5, p. 132.
Seo, Mincheol, Inoh Jung, Jeongbae Jeon, Hyungchul Kim, Junghyun Ham, Hwiseob Lee, Cheon-Seok Park, Youngoo Yang, Dong-Zo Kim and Ki Young Kim
“High Efficiency Pulse Width Modulation Transmitter,” No. 9, p. 110.
Su, Ping, Shiwei Zhao and Zongxi Tang
“Ku-Band Push-Push VCO Based on Substrate Integrated Waveguide Resonator,” No. 5, p. 166.
Wang, LingXia and HaoJia Lin
“Dual Passband Filter with Hybrid Microstrip and Coplanar Waveguide Resonators,” No. 5, p. 152.
Xu, K.D., Y.H. Yang, Y. Fan, W.T. Joines and Q.H. Liu
“A Tri-Mode Bandpass Filter Using Capacitive and Inductive Source-Load Coupling,” No. 5, p. 178.
Xu, K.D., Y.H. Zhang, Y. Fan, W.T. Joines and Q.H. Liu
“Tri-Band Bandpass Filter Using Shorted Stub-Loaded Dual-Mode Resonators,” No. 9, p. 122.
Yang, Li-Li, Lin Li, Ting Lang, Zhi-Hao Zhang and Kai-Yu Zhao
“Wideband BSF Using Coupled Stepped Impedance Hairpin and Interdigital Capacitor,” No. 9, p. 132.
Yun, Young and Jang-Hyeon Jeong
“A Miniaturized Impedance Transformer Employing PGS on GaAs,” No. 1, p. 106.
Yun, Young, Jang-Hyeon Jeong, Hong-Seung Kim and Nak-Won Jang
“RF Characteristics of Coplanar Waveguide Fabricated on Flexible PES,” No. 2, p. 90.
DEVICES
Gammel, Peter
“Turning Complexity into Breakthrough Simplicity,” No. 8, p. 56.
Maleki, Lute
“High Performance Optical Oscillators for Microwave and mm-wave Applications,” No. 10, p. 106.
Moore, Josh
“Device Characterization Methods for Advanced RF/Microwave Design,” No. 5, p. 206.
Narendra, K., E. Limitti, C. Paoloni and V. Zhurbenko
“PHEMT Distributed Power Amplifier Adopting Broadband Impedance Transformer,” No. 6, p. 76.
Sentz, Scott
“Fusion Processing of Surface Mount Components to Mitigate Tin Whiskers,” No. 10, p. 144.
EUROPEAN MICROWAVES CONFERENCE
Mumford, Richard
“Attending European Microwave Week,” No. 9, p. 62.
Mumford, Richard
“The 2013 EuMW Defence and Security Forum,” No. 9, p. 72.
Weigel, Robert and Ivar Bazzy
“Welcome to European Microwave Week,” No. 9, p. 58.
GUEST EDITORIALS
Beasly, Paul and Damian McCann
“GaN In Plastic: A Disruptive Technology,” No. 10, p. 44.
Séné, Guy
“Nurturing Design Innovations for China's Future,” No. 2, p. 74.
INSTRUMENTS/ MEASUREMENTS
Anklam, Bill, Victor Grothen and Doug Olney
“Digital Baseband Tuning Technique Speeds Up Testing,” No. 4, p. 82.
Ferguson, Sean and Haydn Nelson
“Envelope Tracking Fundamentals and Test Solutions,” No. 6, p. 66.
Gorin, Joe
“A New Understanding of Mismatch Error,” No. 10, p. 84.
Knox, Michael and Ben Zarlingo
“Understanding Analyzer Choices: Spectrum, Signal, Vector and Real-Time,” No. 5, p. 196.
Upmaka, Murthy and Dingqing Lu
“Streamlining BER Simulation and Measurement,” No. 7, p. 62.
Xu, Jinbiao
“Full Transmitter Linearization Using a Wideband DPD Measurement Platform,” No. 1, p. 96.
MTT-S CONFERENCE
Hayden, Leonard and Brett Grossman
“81st ARFTG Microwave Measurement Conference,” No. 5, p. 56.
Higham, Eric
“Panel Session: The Death of GaAs?,” No. 5, p. 62.
Hindle, Patrick
“Social Media Grows Up,” No. 5, p. 62.
Raschko, Tom
“Welcome to IMS 2013,” No. 5, p. 50.
Rudell, Jacques C.
“RFIC 2013 General Chair's Message,” No. 5, p. 52.
Vye, David
“Back in Seattle Again,” No. 5, p. 24.
Vye, David
“Introducing Wireless Industry Day,” No. 5, p. 60.
Vye, David
“Trend Spotting at IMS 2013,” No. 8, p. 76.
OPINION
Cho, Samuel
“Powering the Next Seven Billion Voices,” No. 6, p. 40.
Vye, David
“Building Relationships,” No. 11, p. 20.
Vye, David
“The Year That Was…,” No. 12, p. 20.
PRODUCT FEATURES
Aeroflex / Weinschel
“Space Saving Components,” No. 11, p. 38.
Aethercomm
“300 to 400 W GaN S-Band SSPA,” No. 1, p. 134.
Agilent Technologies Inc.
“Signal Analyzer with Real-Time Spectrum Analysis,” No. 3, p. 44.
Agilent Technologies Inc.
“PXI Vector Signal Analyzer and Generator,” No. 9, p. 150.
Agilent Technologies Inc.
“ADS 2014,” No. 11, p. 122.
Analog Devices Inc.
“High Performance Driver Amplifiers,” No. 2, p. 112.
Anaren Microwave
“Femto Size Coupler Line,” No. 10, p. 162.
ATE Systems
“Fully Automated Calibration System,” No. 8, p. 102.
Avago Technologies
“RF Front End Solutions for Small Cells,” No. 7, p. 101.
Boonton
“Real-Time USB Power Sensor,” No. 6, p. 36.
Carlisle Interconnect Technologies
“Locking Push-On RF Connector for Harsh Environments,” No. 3, p. 38.
Cree Inc.
“50 V Telecom GaN Transmitters,” No. 5, p. 222.
Cree Inc.
“GaN Transistors for L-Band Commercial and Military Applications,” No. 11, p. 128.
CST of America
“CST STUDIO SUITE 2013: Performance, Usability and Versatility,” No. 3, p. 114.
DiminuSys
“Compact 0.9 to 40 GHz USB Controlled Tuner,” No. 1, p. 134.
Dow-Key Microwave
“Better, Faster Modular Switch Matrices,” No. 5, p. 236.
Dow-Key Microwave
“Reliant Switch for Better RF Testing,” No. 12, p. 102.
Eastern OptX
“Next Generation Radar Altimeter Testing,” No. 1, p. 46.
EM Software & Systems-SA (Pty) Ltd.
“Deeper Insight Into Antenna Radiation Fundamentals: FEKO Suite 6.2,” No. 1, p. 120.
Empower RF Systems
“500 W, Broadband HPAs in a 3U Chassis,” No. 11, p. 140.
Ethertronics
“Plug-and-Play Solution Module Maximizes M2M Performance,” No. 4, p. 114.
Freescale Semiconductor
“Broadband LDMOS FETs for Land Mobile Radios,” No. 11, p. 28.
Giga-Tronics
“10 W, 100 MHz to 20 GHz Amplifier,” No. 5, p. 232.
Hittite Microwave Corp.
“Highly Integrated 60 GHz Radio Tranceiver Chipset,” No. 2, p. 118.
Hittite Microwave Corp.
“37 to 40 GHz Power Amplifier with Power Detector,” No. 9, p. 170.
Hittite Microwave Corp.
“Microwave Radio Chipsets Cover 6 to 42 GHz Bands,” No. 11, p. 132.
Holzworth Instrumentation
“Automated Additive Phase Noise Measurements,” No. 4, p. 106.
IMST GmbH
“24 GHz FMCW Multi-Channel Radar Module,” No. 12, p. 92.
Infineon Technologies
“Single-Chip Packaged RF Transceivers for Mobile Backhaul,” No. 8, p. 108.
Integrated Microwave Corp.
“High Performance Ceramic Filters,” No. 4, p. 121.
Integrated Microwave Corp.
“Ceramic Coaxial Resonators,” No. 8, p. 112.
Integrated Microwave Corp.
“Ceramic ISM Bandpass Filter,” No. 12, p. 100.
Kaelus (a Smiths Company)
“Portable PIM Tester,” No. 3, p. 128.
Kaelus (a Smiths Company)
“Battery Powered PIM Tester,” No. 11, p. 30.
LadyBug Technologies
“Pulse Profiling USB Power Sensors,” No. 7, p. 92.
LPKF Laser & Electronics AG
“A Shortcut to 3D-MID Prototypes,” No. 11, p. 58.
Linear Technology
“Broadband High Dynamic Range Active Mixer,” No. 11, p. 140.
Lucix Corp.
“Single and Multipack Ka-Band Receivers or Converters,” No. 8, p. 112.
MACOM
“High Power GaN in Plastic Transistors,” No. 8, p. 62.
Marki Microwave Inc.
“Microlithic Mixers: A Paradigm Shift in Mixer Technology,” No. 4, p. 48.
Maury Microwave
“Fast Solid-State Tuner,” No. 9, p. 170.
MIcable Inc.
“Optimized Cable Assemblies Per Application Requirements,” No. 9, p. 160.
Microsemi Corp.
“SP36T Broadband Switch,” No. 6, p. 115.
Microwave Vision Group, ORBIT/FR Inc.
“WiGig Technology Antenna Evaluation,” No. 9, p. 166.
Mini-Circuits
“Wideband Frequency Mixer,” No. 2, p. 122.
Mini-Circuits
“LTCC High Power Attenuators,” No. 7, p. 100.
Norden Millimeter Inc.
“18 to 40 GHz Downconverter Family,” No. 4, p. 118.
Peregrine Semiconductor
“Digitally Tunable Capacitors,” No. 6, p. 114.
Peregrine Semiconductor
“High Isolation, Carrier-Grade Wi-Fi Switch,” No. 11, p. 38.
Pico Technology
“Affordable Analysis for Next-Generation High Performance Designs,” No. 9, p. 156.
Pivotone
“Tri- and Quad-Band Combiners for U.S./EU Markets,” No. 9, p. 172.
Renaissance Electronics Corp.
“RF Simulators for Next Gen Phased Array Radar,” No. 8, p. 70.
RFMD
“Integrated 2.2 V RF Converter with Flexible Tuning Range,” No. 3, p. 120.
Rohde & Schwarz
“Power Sensor Covering DC to 110 GHz,” No. 3, p. 108.
Rohde & Schwarz
“Multipath Vector Signal Generator Simplifies Setup,” No. 5, p. 218.
Rohde & Schwarz
“Power Analysis Solutions for R&S Oscilloscopes,” No. 12, p. 100.
Rosenberger Hochfrequenztechnik GmbH & Co. KG
“Solderless PCB Mount Connectors,” No. 3, p. 36.
Rosenberger Hochfrequenztechnik GmbH & Co. KG
“RF Training Kit,” No. 6, p. 102.
SAGE Millimeter Inc.
“Full Waveguide Band Ortho-Mode Transducers,” No. 6, p. 114.
SAGE Millimeter Inc.
“Ka-Band Digital Attenuator,” No. 8, p. 66.
SAGE Millimeter Inc.
“K-Band FMCW Ranging Sensor Modules,” No. 10, p. 154.
Schott Electronic Packaging and ix-cad GmbH
“Resolving the Complexity of Hermetic RF Hybrid Housings,” No. 7, p. 86.
SIAE MICROELETTRONICA S.p.A.
“Carrier Grade, FDD Radio Using E-Band,” No. 1, p. 130.
SignalCore
“High Performance 9 GHz Signal Sources,” No. 10, p. 172.
Spacek Labs Inc.
“Planar K-Band Receiver,” No. 2, p. 120.
Spectracom
“High-Speed Pulsed Measurements for Radar,” No. 4, p. 122.
SPINNER GmbH
“Attenuator Family Goes Green,” No. 4, p. 120.
SPINNER GmbH
“Connector System for Mobile Communications Market,” No. 11, p. 34.
Stanford Research Systems Inc.
“Affordable Vector Signal Generators,” No. 10, p. 170.
TE Connectivity
“VITA 67 Standards for Connector Modules,” No. 3, p. 42.
Tektronix
“Affordable Mixed Domain Debug and Analysis,” No. 1, p. 124.
Teledyne Microwave Solutions
“Dual-Band Switchable Ka-Band BUC,” No. 10, p. 168.
ThinkRF
“Low Cost Signal Analysis,” No. 12, p. 96.
Triad RF Systems Inc.
“Broadband Bi-Directional Amplifier for Data Links,” No. 5, p. 236.
TriQuint Semiconductor
“802.11ac Modules and WLAN/LTE Filters,” No. 5, p. 232.
TRM Microwave
“Eight-Way 20 to 3000 MHz Power Divider,” No. 3, p. 126.
Vishay Intertechnology
“Surface-Mount Ceramic Chip Antennas for UHF Applications,” No. 6, p. 108.
Vubiq Inc.
“60 GHz Integrated Waveguide Transceivers,” No. 2, p. 44.
W. L. Gore & Associates
“Leaky Feeder Antennas for Airborne Wi-Fi,” No. 10, p. 158.
Werlatone Inc.
“Test and Measurement Directional Couplers,” No. 7, p. 100.
SPECIAL REPORTS
Brizzolara, Davide
“79 GHz High Resolution Short Range Automotive Radar Evolution,” No. 9, p. 78.
Coonrod, John
“Reliably Bend and Form Microwave PCBs,” No. 10, p. 92.
Foley, Alexandra
“Hybrid Linac-MR: Image-Guided Radiation Therapy Delivered in Real-Time,” No. 12, p. 54.
Hopkins, Michael
“Tapping Into a New RF Energy Source Found in Digital Processing Circuits,” No. 12, p. 68.
Huettner, Steve
“High Performance 3D Micro-Coax Technology,” No. 11, p. 108.
Manchec, Alexandre, Yann Clavet, Eric Rius, Abbas Elmostrah, Alain Michel, Erwan Lecomte, Jean Francois Favennec and Cedric Quendo
“Microwave Training Kit: Eductika,” No. 8, p. 66.
Mumford, Richard
“Microwaves in Europe: What’s on the Horizon?,” No. 9, p. 88.
Sheffres, Carl
“Going Mobile,” No. 1, pg. 20.
Vye, David
“EDI CON Program Preview,” No. 2, p. 76.
Vye, David
“The Premier of EDI CON,” No. 5, p. 94.
Vye, David
“EDI CON II,” No. 9, p. 20.
Warder, Phil and Nicolas Layus
“Selecting Filters for Challenging Mobile Applications Worldwide,” No. 11, p. 96.
SUPPLEMENT FEATURES
Dowthwaite, D.M., K.D. Newsome, M.B. Edwards, I.C. Davis and B.M. Coaker
“Receiver Protection in S-Band Radars for Mitigation of 4G Signal Interference,” No. 8, p. 40.
Dudkiewicz, Steve
“Connect with Confidence: Color-Coded Interconnects,” No. 3, p. 30.
Harmon, John
“Design and Test Challenges for Next-Generation 802.11ac, ad WLAN Standards,” No. 11, p. 10.
Hartman, Rick and Tom Bell
“PIM Test Power Levels for Mobile Communication Systems,” No. 3, p. 22.
Hindle, Patrick
“UAVs Unleashed,” No. 8, p. 8.
Johns, David and Patrick DeRoy
“Simulating Crosstalk and EMI in Cables,” No. 3, p. 6.
Kimery, James
“The Road to 5G FAQs,” No. 11, p. 20.
Madden, Joe
“The Economics of GaAs and CMOS PAs: Crunch Time,” No. 11, p. 4.
McCarthy, Darren
“Simplifying Signal Analysis in Modern Radar Tests,” No. 8, p. 52.
Rossler, Andreas and Meik Kottamp
“CoMP: The Most Chllenging Technology Component in LTE-Advanced 3GPP Release 11,” No. 11, p. 14.
Shamblin, Jeff
“Smarter Antenna Front End Modules,” No. 11, p. 24.
Vye, David
“Making the Connection at EDI CON 2013,” No. 3, p. 20.
Wylie, Ian, Gerard Wimpenny and Dave McIntosh
“Envelope Tracking in Next Generation Military Radios,” No. 8, p. 24.
SYSTEMS
Fulcoli, R., M. Sedehi, E. Tilli and, L. Timmonert, B. Edged, R. Fiengo, F. Persia and S. Thompson
“AULOS: A Passive Covert Radar System,” No. 1, p. 72.
Inoue, Takao
“Design, System Integration and Testing of Radar Systems,” No. 10, p. 70.
