Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.
Representatives from Rogers Corp. (www.rogerscorp.com) will be at electronica, in Hall B1, Booth #605, offering guidance on the optimal use of their high-performance printed-circuit-board (PCB) materials for both high-frequency analog and high-speed digital applications.
RT/duroid® 6035HTC laminates and 2929 bondply material will be among the materials on display at Rogers’ Electronica booth. RT/duroid 6035HTC laminates are particularly well suited for high-power RF and microwave applications, including amplifiers, couplers, filters, and power combiners/dividers. These ceramic-filled PTFE composite materials exhibit a relative dielectric constant of 3.5 in the z-axis at 10 GHz with extremely high thermal conductivity of 1.44 W/m-K. They feature high thermal conductivity and a low loss tangent of 0.0013 at 10 GHz for stable and predictable performance in high-power active and passive circuits.
Rogers 2929 bondply is a vital building block for reliable multilayer circuits. This low-loss circuit adhesive is based on a proprietary unreinforced thermoset resin system. It has a dielectric constant of 2.94 in the z-axis at 10 GHz and loss tangent of less than 0.003 in the z-axis at 10 GHz. Compatible with sequential bond processing techniques, 2929 bondply materials are well matched to many of Rogers’ high performance PCB materials, including RO3000® and RO4000® laminates, for building high-performance, high-reliability multilayer circuits.
Visitors to Rogers’ Electronica booth can also learn about the new ROG Calculator App, available online at: www.rogerscorp.com/rogcalc. This free, easy-to-use software packs four computer calculations in one PC tool, providing conversions for commonly used units of measure (such as VSWR and conversion loss), calculations of PCB copper laminate thickness, analysis of circuit material thermal coefficient of dielectric constant (TCDk), and estimations of circuit material coefficient of thermal expansion (CTE).