Rogers' John Coonrod to Speak on Laminate/Prepreg Solutions for Multilayer Circuits

Chandler, Arizona – August 16, 2010 – Rogers Corporation (NYSE:ROG), known for its high frequency, high reliability printed circuit board materials, will be featuring its latest addition to the high-speed digital market at this year’s PCB West 2010 Exhibition (Santa Clara Convention Center, September 29, 2010). PCB West 2010 (www.pcbwest.com), now in its 19th year, is one of the premiere events for the entire PCB supply chain, including engineers, fabricators, and assemblers.

Members of Rogers Advanced Circuit Materials (ACM) Division will be at booth # 101 to explain optimal use of their halogen-free Theta™ circuit materials in addition to RO4000® LoPro™ laminates, and recently launched RO4360™ 6.15 Dk thermoset laminate and RO4460™ 6.15 Dk thermoset prepreg.

Rogers Theta materials are ideal for high-speed digital applications requiring environmentally friendly, lead-free processing. These halogen-free materials feature a dielectric constant of 3.8 at 1 GHz and low loss, with a dissipation factor of 0.008 at 1 GHz. They are compatible with RoHS-compliant lead-free solder processing, and low z-axis coefficient of thermal expansion (CTE) for reliable plated-through-hole (PTH) performance in multilayer designs.

Looking for an alternative to PTFE? Rogers RO4000 LoPro laminates can be used for both high-speed digital and high frequency analog applications. They can be processed like FR-4, but provide electrical performance close to PTFE. The combination of a low-profile copper foil and low-loss dielectric material yields low loss, excellent passive intermodulation (PIM) performance and improved power-handling capability.

For those attending the technical conference on Thursday, September 30, Rogers’ author and speaker, John Coonrod, will highlight the use of 6.15 Dk RO4360 laminate in combination with the recently introduced RO4460 6.15 Dk prepreg as a breakthrough cost savings solution for many multilayer applications. With a loss of 0.003 at 2.5 GHz for both materials, this material system supports the miniaturization of many high-frequency circuits such as amplifiers and filters, giving higher yields per PCB panel.