M/A-COM, a business unit of Tyco Electronics and a provider of wireless radio frequency (RF), microwave and millimeter-wave components, announced the Radio Frequency Integrated Circuit (RFIC) assembly and testing service targeted towards commercial and defense applications and manufacturers. Based in the company's Lowell, MA facility, M/A-COM's reduced time-to-market assembly and testing services include the design, manufacture and test of RFIC multi-chip modules for ceramic, ball grid array (BGA), land grid array (LGA) and chip scale devices.
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From prototype to production, M/A-COM offers the following process capabilities for RFIC assembly and packaging:
· Auto epoxy and eutectic die attach
· Auto ball and wedge bonding
· Low volume SMT (0201 placement)
· Eutectic and B-stage lid seal
· Fine and gross leak testing
· Auto liquid encapsulation
· Laser mark and auto scribe
· Auto solder ball attach
· Auto saw and trim & form
· Auto test
· Environmental screening
M/A-COM also offers the following design, manufacture and test competencies:
· Process engineering
· Mechanical/tooling design (2D & 3D)
· Packaging design
· NPD and quick-turn prototyping (TTM)
· Continuous improvement (Six Sigma)
· Test interface development
· Test automation and data analysis
· Supporting high volume and high mix
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