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SweGaN AB announced it has completed a Series A financing round totaling 125 MSEK (12 million Euro) and announced the appointment of Jr-Tai “Ted” Chen as CEO.
Menlo Microsystems, Inc. (Menlo Micro) announced that it has joined the American Semiconductor Innovation Coalition (ASIC) in its effort to ensure that the funding provided through the historic CHIPS and Science Act will be effectively employed to advance U.S. semiconductor R&D leadership and improve the pathway from research to manufacturing.
In its first 2022 volume, "RF Front-End Module Comparison 2022 – Vol. 1 – Focus on Apple," Yole SystemPlus provides insights into technology and cost data for FEMs and several components found in 18 smartphones from the Apple iPhone series since 2017.
X-FAB Silicon Foundries announced a further expansion of its longstanding partnership with the Leibniz Institute for High Performance Microelectronics (IHP) where X-FAB will now license IHP’s SiGe technology.
Cadence Design Systems, Inc. announced that it has collaborated with GlobalFoundries (GF) to accelerate 5G and mobile design innovation through the delivery of the Cadence® RF and mmWave flow for the GF 22FDX platform.
Richardson RFPD, Inc. announced the availability and full design support capabilities for a new GaN high-power amplifier from United Monolithic Semiconductors.
An international research team at WPI-MANA has used a transmission electron microscope (TEM) to create a 2.8 nm transistor consisting of nanochannels embedded in metallic carbon nanotubes (CNTs), which exhibits quantum transport at room temperature.
3DGaNTMinnovators Finwave Semiconductor, Inc.ctor, Inc. announced a $12.2 million Series A funding round to expand the company’s team, product development activities and lab facilities.
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