RF & Microwave Industry News

Tempest Telecom Solutions Adds 3 High Level Executives

As the company prepares for growth, Tempest Telecom Solutions announced the addition of three new high level executives: Glenn Edwards as vice president and general manager of repair and logistics, Amaro Oliveira as vice president of business development and Michael Kletchko as senior vice president of sales & marketing.


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TE Conn

Richardson RFPD Introduces New Board Level Shields from TE Connectivity

Richardson RFPD  announced the availability and full design support for a new portfolio of board level shields from TE Connectivity. These new board level shields are stamped one- and two-piece metal cages that help provide isolation of board-level components, minimize crosstalk and reduce EMI susceptibility without impacting system speed.


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