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imec announced it has demonstrated — for the first time — a low-cost, impingement-based solution for cooling ICs at the package level. This is an important innovation to tackle the ever-increasing cooling demands of high performance 3D chips and systems.
Dialog Semiconductor plc announced that it is adding Bluetooth Special Interest Group (SIG)-compliant mesh support to its popular SmartBond™ Bluetooth low energy system on chip (SoC) family of devices.
EpiGaN is highlighting the latest enhancements of its GaN epiwafer solutions for RF power and power switching at the IEEE International Microwave Symposium (IMS 2018) in Philadelphia, Pa.
HUBER+SUHNER has announced it will showcase its RF-Energy connector for optimal power handling and performance, for the first time at IMS2018 in Philadelphia, June 10-15.
ALPHA–Route des Lasers & des Hyperfréquences® announces it will bring six cluster members to the International Microwave Symposium (IMS) 2018, taking place on June 10–15, in Philadelphia, Pa.
U.K.-based AtlanTecRF has launched a completely new range of test products to complement its already extensive offering of satellite simulator and loop-back systems.
Lark RF Technology, a Benchmark company is exhibiting at Booth #2341 at the IEEE MTT International Microwave Symposium (IMS) 2018 where it will be demonstrating its liquid crystal polymer (LCP) high density interconnect (HDI) technology for high frequency circuits from 10 to 100 GHz.
TDK Corporation presents several of its latest RF technologies in Booth #1207 at International Microwave Symposium (IMS) 2018, June 12-14, at the Pennsylvania Convention Center in Philadelphia, Pa.
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