RF & Microwave Industry News

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Transline Technology, a California-based printed circuit board manufacturer, has been recognized by Lockheed Martin Aeronautics for 100 percent on-time delivery and zero quality deffects for 12 consecutive months for the year 2012. TTI also received this award for the year 2011, which means that they have had a 24 consecutive month track record of delivering 100 percent on time delivery and zero defects in total.

Astrium Americas announced that its subsidiary, Astrium Services Government Inc., will offer UAE-owned Yahsat Military Ka-Band service to the U.S. government. This service allows any U.S. government or Department of Defense end user to utilize Yahsat Military Ka-Band capacity that is compatible with the Wideband Global Satellite (WGS) constellation for greater global coverage and reliability.

Mercury Systems Inc., a best-of- breed provider of commercially developed, open sensor and big data processing systems for critical commercial, defense and intelligence applications, confirmed it had received $6.9 million in follow-on orders from Lockheed Martin for high performance signal processing subsystems as part of the U.S. Navy’s Aegis Ballistic Missile Defense (BMD) upgrade program.

The IEEE MTT-S 2013 International Microwave Symposium (IMS) is set to debut Wireless Industry Day, which will be held on June 5 at the Washington State Convention Center as part of Microwave Week. Wireless Industry Day is designed to showcase both emerging technologies and provide practical, application-oriented information to attendees and the regional wireless community.

CTS Electronic Components Inc. announces development of Model 144, an oven controlled crystal oscillators (OCXOs), which uses the unique internal heated resonator (IHR) technologies to significantly reduce power consumption while maintaining excellent performance.

Northrop Grumman Corp. and the U.S. Navy have conducted the first fly-in arrested landing of the X-47B Unmanned Combat Air System (UCAS) demonstrator.

Richardson RFPD Inc. announces availability of the latest Silicon Carbide (SiC) power MOSFET from Cree Inc. (Cree). The second-generation SiC Z-FET™ 1200V MOSFET C2M0080120D delivers industry-leading power density and switching efficiency, at half the cost-per-amp of Cree’s previous-generation MOSFETs.

The selection of Metrigraphics LLC as a second source for a tiny sensor substrate has bloomed into big business, with deliveries of the micro flex circuit surpassing 14 million units this month.  Metrigraphics works with designers and engineers to take their designs and fabricate them at rapid rates. 

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.