RF & Microwave Industry News

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China Mobile Ltd. has purchased FIME’s EMV^®contactless analogue test bench and FIME will additionally offer consultancy services and carry out pre-certification vendor handset testing.

Luso Electronics has opened a new design and manufacturing facility in Luton, UK, that will boost the company's delivery of fully integrated turn-key installations and microwave products to meet increasing demand, primarily from commercial and military satellite communications customers.

Anite, together with HiSilicon has verified Release 10 LTE-Advanced protocols in HiSilicon’s newly developed LTE-A chipset.

Rohde & Schwarz has expanded the functionality of its R&S FSV and R&S FSW signal and spectrum analyzers to also support the IEEE 802.11p wireless standard. The new R&S FSV-K91p and R&S FSW-K91p measurement options are especially designed for IEEE 802.11p compliant signal analysis in V2V applications and ITS.

Selex ES and BAE Systems have signed a teaming agreement that will see the two companies working together to provide Electronic Warfare Operational Support for Eurofighter Typhoon customers.

Corry Micronics has released its filtered micro-d sub adapter product line for direct sale. Don Pavlek, president and CEO of Corry Micronics stated that the company has been manufacturing industry-standard filtered d-sub adapters for over 10 years but customer demand for filtered micro-d sub adapters has increased over the past 12 months.

Technology Corp., a manufacturer of USB controlled and powered test equipment, has added two new models to the itsLab Brick Phase Shifter family, the LPS-402 and LPS-123.

COMSOL Inc., a leading global provider of engineering simulation software, announced the release of COMSOL Multiphysics® 4.4, the latest version of its powerful platform for the modeling and simulation of electrical, mechanical, fluid, and chemical applications.

AWR Corp. announces the release of V11 Analyst-MP™ - multiphysics FEM EM analysis software. Analyst-MP is an application-specific product offering from AWR that leverages the capabilities within its Analyst™ 3D FEM EM simulation and analysis software while targeting big, multiphysics applications like particle accelerators.

Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.