RF & Microwave Industry News

NFC will come out of the trial phase in 2013 as 285 M enabled devices are expected to be shipped

ABI Research forecasts that a total of 1.95 billion NFC-enabled devices will ship in 2017 — a combination of both handsets and CE Devices. The lion’s share of NFC enablement will continue to be focused in the handset market, although we are expecting a surge of NFC functionality included within CE devices, for simple pairing of devices, exchange of data, and online authentication functionality. In total, 395 million CE devices will ship in 2017, predominantly into media tablets, PC accessories, and gaming consoles.


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Ardent's compression mount connector ideal for high speed SerDes and advanced applications

Ardent Concepts has announced the availability of a new, patented, high density termination assembly solution for true 40 Gbps/40 GHz coaxial-to-PCB transition. The Terminate-R™ from Ardent Concepts is a compression mount (solderless) connector designed to provide the lowest loss interface between multiple lanes of high speed digital channels on a PCB to another PCB or measurement instrumentation.


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MagnaChip and Peregrine expand production of RFIC/DTC products

MagnaChip Semiconductor Corp. ("MagnaChip Semiconductor"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced that MagnaChip has expanded production of Peregrine Semiconductor's STeP5 UltraCMOS® technology-based RFIC product line, including the most recent DuNE™ Digitally Tunable Capacitors (DTCs) for RF impedance tuning.


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