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National Instruments announced 10 pieces of new application IP that enable engineers and scientists to use NI LabVIEW system design software to build their own custom RF instruments. This IP integrates with PXI FPGA targets such as the NI PXIe-5644R VST and extends their default capabilities.
To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.
Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.
M/A-COM Technology Solutions Inc., a supplier of high performance analog semiconductor solutions, announced a new broadband diplexer, specifically designed for CATV Customer Premises Equipment (CPE) applications.
The Taiwanese telecommunications company Chunghwa Telecom, as the prime contractor, has awarded Cassidian the contract to deploy an island-wide TETRA network in Taiwan.
Nujira Ltd. has released the details of significant test results that demonstrate how Envelope Tracking (ET) technology unlocks the potential of RF CMOS PAs for high end 3G and 4G smartphone applications.
Ericsson has now validated that MINI-LINK products in traditional frequency bands can operate in non-line-of-sight (NLOS) conditions with high performance.
In 4Q-2012, the LTE subscription in Asia-Pacific has increased by 60.92 percent quarter-on-quarter (QoQ), reaching 34.6 million. ABI Research expects that the LTE subscription market will continue to grow rapidly in 2013 to reach 72.1 million. “The operators in South Korea have aggressively promoted LTE since launch.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.