RF & Microwave Industry News

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Broadcom Ltd. announced a new dual-channel 5GHz Wi-Fi access point platform designed to enable enterprise and public venue operators to optimize performance for all connected devices. The Broadcom® 5G-HD platform is built on the new BCM49408 quad-core CPU, enabling client devices that are 5GHz 11ac-capable to maintain the fastest possible speeds by eliminating performance degradation that occurs when slower client devices share traditional single channel 5GHz Wi-Fi access points.

Altair has acquired AWE Communications GmbH (AWE) based in Gärtringen, Germany. AWE was founded in 1998 as a spin-off from the University of Stuttgart and the main focus has been the development of the WinProp Software Suite for wave propagation and radio network planning.

At bauma 2016, Infineon is presenting its latest 24 GHz radar solution, which was developed for the modern, radar-based assistance systems in trucks and construction machines.

Raytheon has signed its largest deal to date with a Danish supplier, finalizing a DKK 100 million mission systems deal with Terma.

Huawei’s 13th Global Analyst Summit focuses on the theme of "Growing Together Through Digitalization and Building a Better Connected World."

Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, will be exhibiting a forthcoming terahertz (THz) frequency on-wafer cryogenic probing arm at next week’s 10th European Conference on Antennas and Propagation (EuCAP) in Davos, Switzerland.

The Navy’s Next Generation Jammer (NGJ) Increment 1 (Inc 1) received the official go-ahead to enter the next phase of development April 5 when the Milestone Decision Authority signed the Acquisition Decision Memorandum.

Custom MMIC, a leading developer of performance driven monolithic microwave integrated circuits (MMICs), recently moved their offices to Chelmsford, Massachusetts. This move will support the company’s rapid growth, providing a threefold increase in office and lab space.

Molex, a leading global manufacturer of electronic solutions, announced the acquisition of Interconnect Systems Inc. which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.

NI announces that NI AWR Design Environment™ V12 will be highlighted at the Electronic Design Innovation Conference (EDI CON) 2016, being held in Beijing, China April 19-21. In addition to demonstrations in NI Booth #315, the software will be featured in two 40-minute workshops.