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Richardson Electronics Ltd. announced a new distribution agreement with Junkosha USA Inc., a leading manufacturer of high quality, ultra-high performance microwave cable assemblies.
Microchip Technology Inc. and Microsemi Corp. announced that the two companies have signed an agreement for Microchip to acquire Microsemi for $68.78 per share in cash.
Mercury Systems Inc. announced it received a $3.8 million follow-on order from a leading defense prime contractor for state-of-the-art RF subsystems that are integrated into an advanced airborne electronic warfare (EW) system.
The AN/TPS-80 Ground/Air Task-Oriented Radar (G/ATOR), built by Northrop Grumman Corporation, has been approved for early fielding by the U.S. Marine Corps.
Huawei has selected Rohde & Schwarz (R&S) to provide comprehensive testing solutions for NB-IoT terminal chipsets designed by HiSilicon, a Huawei company. Test solutions will extend from R&D to certification and final device production.
Rohde & Schwarz (R&S) and Unigroup Spreadtrum & RDA are to establish a joint operator test laboratory in China as part of a memorandum of understanding (MoU) signed at Mobile World Congress in Barcelona.
ZTE Corporation, collaborating with China Mobile and Qualcomm, demonstrated the world’s first end-to-end IoDT test based on the latest 3GPP 5G NR standard and revealed the test results of the world’s first sub-6 GHz 5G field trial at Mobile World Congress 2018 in Barcelona, Spain, thereby demonstrating its great strength in 5G field.
International Wireless Communications Expo (IWCE), the premier annual event for communications technology professionals, has introduced the second annual IWCE Young Professional Award winners.
At Mobile World Congress, the Qualcomm/TDK Joint Venture, RF360 Holdings, announced what the company said is the first hexaplexer, covering FDD cellular bands 25, 30 and 66. The six-band filter uses SAW and BAW technologies.
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