IMS2024 Show Wrap Up

This year’s IMS, held June 16-21 in Washington D.C., can go down in the books as another success. Over 7,800 members of the RF and microwave community from across the globe attended IMS under the theme "Capitalizing Across the Spectrum." With over 500 companies exhibiting, it’s hard to make time to visit every booth. Below are some of our favorite products from the trade show floor. 

Also, be sure to check out our IMS video gallery here and photo album here. 

3dGS

3D heterogeneous integrated system-in-package process reduces systems size by stacking multiple glass substrate layers in the z-direction. The process can integrate Si, GaAs, GaN, SiC, SiGe, SMT capacitors, packaged die and others into a SiP. Wire bonding, flip chip, MST solder and other approaches make it easy for assembly. Size reduction can be 60-98% with greater than 80% reduction in weight with greater than 20% reduction in power consumption.

Aaronia AG

Aaronia AG presented its revolutionary solutions for the future of spectrum analysis and frequency monitoring in Hall A, Booth 224. The real-time spectrum analyzers of the SPECTRAN® V6 series are specially designed for near-field and far-field measurements, for locating signals or sources of interference or for monitoring EMC problems. The real-time bandwidth of up to 450MHz and the sweep speed of >3,000 GHz/s accelerate all necessary measurements enormously, thus saving time and money. The analyzers are also ideal for broadband frequency monitoring, for example to ensure the proper use of assigned frequency bands. The location and identification of illegal transmitters and the elimination of interference caused by them is also easily possible in conjunction with the broadband antenna arrays from Aaronia.

AGC Multi Material America

Visitors to booth 1012 learned more about AGC Multi Material’s comprehensive material offering including PTFE and thermoset laminates and bondply solutions for satellite, automotive, telecom, medical, industrial, defense and RF components, fastRise bondply materials, Meteorwave low loss substrates and the well-known TSM-DS3 and TLY PTFE materials.

Altum RF

Altum RF showcased its featured products and technical expertise in Booth #510 at the Walter E. Washington Convention Center. Company leaders were in the booth to answer questions about specific products, future plans and their decades of experience designing and delivering RF, microwave and mmWave semiconductors.

Altum RF’s lineup of broadband Q/V/E-band low-noise and medium-power amplifiers enable next-generation technology and high-capacity networks. Applications include test and measurement, SATCOM, sensing applications and point-to-point wireless communication for 5G and 6G networks. These high frequency amplifiers use advanced GaAs technology, which delivers low noise figure and linear amplification with less signal distortion at medium power.

Amphenol RF 

Amphenol RF announced the expansion of their robust reverse polarity TNC portfolio with additional configurations designed to accommodate micro-coax cable types including 0.81 mm, 1.13 mm, 1.32 mm dual shielded, 1.37 mm and RG-178. 

RP-TNC plugs and jacks are manufactured with nickel plated, brass bodies and gold plated, beryllium copper contacts. They utilize a PTFE insulator similar to existing RP-TNC connectors and offer the same features and benefits customers have come to expect from this durable interface. Front mount bulkhead jack configurations are available which can be fastened on the inside of a panel or enclosure and provides additional security for sensitive systems.

RP-TNCs utilize a familiar threaded interface to ensure mating stability and reliable electrical performance. These RP-TNC connectors join a robust portfolio of reverse polarity RF interconnect available to meet various design requirements across verticals.

Analog Devices

ADI was showcasing the industry’s most complete, high-performance digitization and processing platform—Apollo MxFE™.  ADI featured their latest RF, microwave, millimeter wave technologies, clocking, amplifier, and power solutions that are working together to enable system-level solutions for communications, instrumentation, aerospace, and defense customers. Analog Devices expanded their portfolio of GaN power amplifiers with the new ADPA1113, pushing the limits of commercial GaN. ADPA1113 enables next-generation signal generation and sensing goals across an array of applications, from multi-mission radars and EW transmitters to RF test equipment and beyond. ADPA1113 provides 40 W CW saturated output power at 40 percent PAE from 2 to 6 GHz in a 10 mm x 12 mm flange package. Their demos included Apollo MxFE: Direct RF Sampling at 40GSPS, Apollo MxFE: Direct RF Sampling at 40GSPS, Low Power, High Dynamic Range, Multi-Channel GNSS Receiver, Nevis Narrowband Transceiver: Enabling Advanced Digital Signal Processing at the Edge, 0.1-20 GHz 4T/4R 3UVPX Tuner+Digitizer+Processor, and GaN Power Amplifiers and Biasing Solution.

AnaPico

AnaPico is an ISO9001:2015 certified company that manufactures and supplies RF and microwave test and measurement instruments for a wide range of civil and governmental applications. The company has been heavily investing in R&D and is dedicated to creating and continuously improving its T&M solutions. The company was spotlighting its APLC series of low-phase-noise analog signal generators up to 40 GHz that come in single- and multi-channel models.

Anritsu

Anritsu offers a broad spectrum of products spanning research, development, conformance testing, optimization and service assurance. It has pioneered RF and microwave technologies in communication, aerospace, defense and education. Anritsu provides solutions for test, measurement and service assurance applications. Their product and solution portfolio encompasses wireless, optical, microwave/RF and digital instruments coupled with operational support systems. These solutions find utility throughout the R&D, manufacturing, installation and maintenance phases.

Antenom 

Antenom exhibited the 20 GHz Horn Antenna Kits for the first time at IMS2024.  This kit can build the desired horn antenna structure using reusable Anten'it blocks up to 7.5 GHz, and at higher frequencies up to 20 GHz using curved blocks. Thus, instead of purchasing separate antennas for each antenna gain, many different apertures with different gains can be added to a single antenna. The adapter part, to which the antenna connector is connected, is built with Anten'it blocks, while the aperture part is built with Anten'it blocks at frequencies up to 7.5 GHz, and with curved aperture blocks at higher frequencies.

B & Z Technologies

 B&Z TEchnologies have been designing microwave and millimeter wave amplifier technology for more than thirty years. B&Z designs and supplies high reliability, ultra-wideband, low noise, medium power, microwave and millimeter wave amplifiers. Most of these are capable of operating at cryogenic temperatures. All designs fit into a single standard housing. and various power, gain and noise figure combinations, anywhere in the 5 kHz to 60 GHz range are possible in this standard chassis.

Cadence

Cadence IMS educational sessions were available to learn how to improve your RF/microwave designs with workflows addressing MMICs, RFICs and modules, IC packaging, PAs, RF PCBs and 5G and radar systems.

• Machine Learning (ML) and Analysis Advancements Embedded in a Complete High-Frequency Design Flow 
• High-Frequency IC/Package Co-Design Using Integrated Toolsets 
• PDKs for Microwave Design Platform Expand Functionality to Silicon MMIC Designers 
• Enabling Electromagnetic Simulations with Encrypted Components  
• Utilizing Real-World Signals in Simulation  
• Advancements in Linear and Non-Linear Bidirectional Impedance and Stability Analysis 
• Interoperable Design Platforms Support High-Frequency Silicon MMIC Design 

Cheshir Industries

Cheshir Industries is a new company focusing on gradient index (GRIN) lens antennas for satcom, defense and commercial wireless applications. Their solution offers fully-passive beamforming that is pattern agnostic and multi-band and pattern agnostic.

Cinch Connectivity

Cinch Connectivity Solutions, a Bel group company, was exhibiting its latest RF and microwave connectivity products from Johnson, Midwest Microwave, Trompeter and Semflex in Booth 1831. From these product lines, Cinch offers a wide range of cable assemblies, connectors, adapters, attenuators, couplers, dividers and accessories for a wide variety of commercial and defense market applications. For RF applications, the frequency range of some of the products goes up to 129 GHz.

CML Microsystems

CML Micro designs, develops and supplies mixed-signal, RF and microwave semiconductors for global communications markets. Headquartered in the UK with an RF and low-power IC design team, they have a global supply operation with offices in the US and Singapore. The CML Microsystems product portfolio includes a broad range of mmWave MMICs, RF transceivers, baseband processors, data controllers and interface devices, which are used in various applications such as critical communications, satellite and network infrastructure. CML prides itself on delivering high-performance IC solutions that enable efficient and reliable data transfer, signal processing, and system integration. Their portfolio provides components supporting both RF and baseband functionality, encompassing both leading-edge digital and legacy analog systems.

Comsol

COMSOL announced the release of COMSOL Multiphysics^® version 6.2 last Nov adding data-driven surrogate model functionality for efficient standalone simulation apps and multiphysics-based digital twins. It also features high-performance multiphysics solvers for the analysis of electric motors, up to 40% faster turbulent CFD simulations, and an order of magnitude faster impulse response calculations for room and cabin acoustics. Additionally, it is now up to 7 times faster to perform boundary element analysis for acoustics and electromagnetics when running on clusters. The Deep Neural Network (DNN) function provides training and validation using a deep neural network for use with surrogate model training, for example. Deep neural networks form a class of machine learning algorithms similar to the artificial neural network and aims to mimic the information processing of the brain.

Copper Mountain Technologies

Copper Mountain Technologies showcased a new turnkey solution for customers needing to make far-field, mmWave and sub-THz antenna measurements above 18 GHz in booth 1111. The OTA antenna test system features a wide array of configurations depending on the user’s far-field requirements, antenna size, desired frequency range and antenna positioner functionality.

CMT also partnered with MilliBox and Eravant to offer a complete OTA antenna measurement chamber solution ranging from 18 GHz to 220 GHz. Each OTA system includes a benchtop compact anechoic chamber, a 3D antenna positioner (gimbal), sophisticated but intuitive measurement software, and other necessary accessories to fully set up a chamber for far-field antenna measurements. Each system is anchored by CMT’s 2-port 9 GHz Cobalt VNA and includes a set of frequency extenders for the measurement band of your choice.

ConductRF

At IMS, ConductRF featured versatile, high performance MIL-STD D38999 cable assemblies and VITA 67 style cable assemblies that meet the stringent requirements of SOSA (Sensor Open Systems Architecture) standards. These advanced cable assemblies exemplify ConductRF's commitment to providing military and aerospace customers with exact, custom built assemblies and wire harnesses. 

The D38999 design is renowned for its ability to meet the demanding requirements of high frequency performance, multi-signal management, flexibility and durability in tough land and sea environments. These assemblies play a pivotal role in various military applications, from communication systems to radar and electronic warfare equipment.

ConductRF’s VITA 67 cable assemblies are specifically designed to meet SOSA standards, and are available with the following RF Contacts: VITA67.1/.2/.3, aka “SMPM”, “SMPS”  and “NanoRF” connectors.

Corning Incorporated 

Corning Incorporated launched its Corning® Gilbert ® POLYLINK^TM technology at IMS. POLYLINK is the RF and microwave connectivity industry’s first gold-plated plastic microwave connector. At the symposium, Corning experts also showcased Corning Gilbert’s traditional metal blindmate interconnects. These connectors are trusted by customers for use in telecommunications, radar systems, shipboard, airborne, and ground-based missile programs and for cryogenic and non-magnetic applications.

Crystek Crystals Corporation

Founded in 1958, Crystek Corporation has a broad product offering, including quartz crystals, XOs, TCXOs, VCOs  and VCXOs. Crystek Crystals is dedicated to the development and manufacture of frequency products using quartz-based resonators. Crystek Microwave develops frequency control and support products for the microwave industry. Other products include: PLL synthesizers, redBox VCOs, RF coaxial cable assemblies, RF cable connectors, bulk RF coaxial cables, RF power detectors, filters, attenuators, DC blocks, passive doublers, RF pocket reference oscillators, connectorized amplifiers, VCO evaluation boards, RF lab kits, SAW-based clock oscillators and VCXOs and power regulators for end markets including wireless, microwave radio, telecom, industrial, enterprise, aerospace and government sectors.

dB Control

dB Control unveiled new products in Booth 2112 at IMS. The new dB-9006 Magnum Opus Microwave Synthesizer provides best-in-class phase noise performance (between 10 dB and 20 dB better than competing models), a wide frequency range (100 MHz to 27 GHz with 1 Hz resolution mode), -80 dBc non-harmonic spur performance and fast tuning (<50 mS), with a secondary output tuning at 1 to 2000 MHz. 

The new dB-8048 GaN solid state power amplifier operates in the 2.9 to 3.3 GHz frequency band, delivers 1.5 kW peak output power in pulsed operation with instantaneous pulse operation over the entire band, has a duty cycle up to 10 percent, a 0.5 mS pulse width and 50 Ohm input/output impedance. 

dB Control also exhibited its recently introduced dB-8015 very wideband GaN SSPA Microwave Power Module (2 to 18 GHz, 200 W CW) and a full line of reliable high- and low-voltage power supplies, high-power TWT Amplifiers (TWTAs) and microwave power modules (MPMs) for mmWave applications.

ED2

ED2 presented their display of high-tech Advanced Glass Packaging Technology (AGPT) products and packaging options. ED2 has pioneered the use of fused silica in heterogeneous semiconductor packaging and offers solutions with ultra small feature sizes and excellent high frequency performance. Their services include passive devices and packaging designed in low loss glass.

ELDAAS Technologies

ELDAAS Technologies Inc., a leader in advanced electronic product design, announced the launch of Spandana, its latest Ground Surveillance Radar system, at the International Microwave Symposium (IMS) 2024. Spandana represents a significant leap forward in radar technology, offering unparalleled precision, reliability, and cost-effectiveness for diverse surveillance and security applications. 

Key Highlights of Spandana: Advanced Technology Integration: Spandana incorporates cutting-edge technologies including Multiple Input Multiple Output (MIMO), Artificial Intelligence (AI), and digital beamforming to deliver superior detection and classification of targets in real-time. Cost-Effective and Compact Design: Spandana is designed to be affordable and easy to deploy. Its small form factor and low power consumption make it ideal for a wide range of applications, from critical infrastructure protection to urban security. High Precision and Reliability: Operating in the C-band frequency range, Spandana provides high-precision detection with less than 1-meter accuracy. It is engineered to perform reliably in all weather conditions, ensuring continuous monitoring and threat detection. Versatile Applications: The radar system is suitable for various sectors, including critical infrastructure, perimeter security, urban monitoring, and now, enhanced safety for public spaces. Spandana's advanced AI algorithms enable efficient object classification, including the detection of firearms in sensitive areas such as schools, churches, and public gatherings, making it an ideal solution for modern security challenges. Scalability and Integration: Designed with scalability in mind, Spandana can be easily integrated with existing security systems and expanded to cover larger areas or multiple sites. Its digital beamforming technology allows for extensive area coverage and precise target tracking.

Empower RF Systems

Empower RF develops solid-state , high-power RF and microwave amplifier solutions for EW, threat simulation, radar and communications. Pulse and CW solutions range from tens of watts to hundreds of kilowatts with a lineup of modules, rugged air cooled rack mount configurations and scalable liquid-cooled racks for high power. The liquid-cooled family also offers “on-air” hot swapping for mission-critical applications. With a flexible software-defined operation that allows adaptability to future communications, radar and EA waveforms.

Eravant

Eravant focuses on supplying a global customer base with millimeter wave and sub-THz (18 to 330 GHz) components, subassemblies, and test equipment. Eravant is an AS9100D certified, ITAR-registered, women-owned small business designing and manufacturing in the United States. The company’s vision is to make millimeter wave and sub-THz accessible by lowering budget, knowledge and experience barriers so more engineers and scientists can work to realize the technology of the future. Eravant now has four business units: Test & Measurement Equipment; Calibration & Measurement Services; Custom System Applications; and Millimeter Wave & Sub-THz COTS.

ERZIA

ERZIA announces a new distribution partnership with Impulse Technologies, a manufacturer and distributor of RF components based in New York. As ERZIA continues to grow and expand its reach in the U.S., it was natural to partner with an industry pioneer and trusted RF distributor.

Both companies exhibited at IMS: ERZIA  at booth #428 and Impulse Technologies at booth #1144. 

ERZIA has experienced exponential growth in the past few years, celebrating its 20th anniversary and doubling product production. The company also expanded its facilities in Santander, Spain to accommodate the growth of the team and recently renewed its ISO 9001 certification. With a strong presence already established in Europe, ERZIA has been expanding its representation in the US, first working with a partner on the West Coast, and now with Impulse Technologies, who is strategically located on the East Coast, with easy access to ERZIA’s subsidiary office in Virginia.

Exxelia 

At booth 2108, Exxelia highlighted its main RF/microwave capacitor ranges: Super HiQ and High-Power High-Q CP/CL series and also its innovative range of microwave ferrites, including a pre-launch of a highly anticipated high-epsilon microwave ferrite material. Exxelia exhibited its comprehensive range of materials and tuning components, with a special focus on its cutting-edge microwave ferrite products. These advanced components are engineered to meet the rigorous demands of modern microwave applications, providing unparalleled performance and reliability.

As a highlight of their presence at IMS Microwave Week, Exxelia pre-launched a new high-epsilon microwave ferrite. This new high-epsilon ferrite is featuring a permittivity of 21 and is available in two versions (YK21 and DK21) to address all power applications. It represents a significant advancement in ferrite technology, engineered to enhance the performance of high frequency radar systems, especially in active electronically scanned array radar applications. This new component delivers exceptional magnetic properties and stability, crucial for the optimal performance of isolator and circulator devices.

Filtronic

Filtronic specializes in designing and manufacturing high-performance microwave and mmWave subsystems for the aerospace, defense, space and telecom markets. The company focuses on developing high-frequency subsystems that require critical performance and reliability, particularly in complex high-frequency bands for satellites, fighter jets and communication networks. Filtronic was touting that they have delivered over 80,000 transceivers to telecom applications. They claimed to have developed the world's first commercial E-Band earth station antenna, which is opening up 5G performance and latency to the Satcom market and the first 40 Gbps stratosphere-to-ground link.

Flann Microwave

Flann Microwave designs and manufactures passive RF, microwave and millimeter wave products, solutions and services. Flann produces critical and subsystems required to deliver, test, measure and calibrate systems operating from 300 MHz to 1.1 THz. Its product portfolio includes antennas, diplexers, adaptors, attenuators, switches, couplers and terminations to custom waveguide assemblies and integrated networks. In response to their markets moving higher in frequency, they are continually developing mm-wave and sub-mm-wave bands to enable customers to meet the most challenging performance criteria. Just prior to IMS, Flann introduced a new company logo, which was on display in Booth #1152. The logo was also accompanied by a live demonstration showcasing a range of WR-6 (WG-29) waveguide components used in 6G research and development.

Fortify

Fortify is an RF & microwave device company using a patented manufacturing platform to create high-value communication and radar systems. The company targets applications such as wide-band SATCOM terminals, tracking & guidance, or passive devices used in radar and signature management systems. They had an interesting demo that showed how inserting a 3D printed lens in front of a transmitter increased the power level.

Gel-Pak

Gel-Pak showcased its component handling solutions for RF/microwave devices at IMS2024. The company featured its newest innovations including its new Vertec® VRP boxes and VRV Vacuum Release Carriers. These silicone-free carriers look and function similar to the market-leading Gel-Box™, Gel-Tray® and Vacuum Release Tray products, but with an alternative elastomer technology. The proprietary elastomer material is both static dissipative and non-silicone

The company also showcased its Textured Film Carrier products (BTXF), which are based on a reversible adhesion technology known as the Gecko effect. These device carriers use microstructures to securely hold components in place during shipping and handling yet allow for easy release. The film is ideal for in-process device handling and for shipping of packaged components. The product is available in 2”,4”, JEDEC standard trays. 

HYPERLABS

Founded in 1992, HYPERLABS provides broadband amplifier products including linear amplifiers that go to 65+ GHz in support of PAM-4 data-driver requirements with a focus on maintaining optimized eye patterns. For higher power requirements, HYPERLABS offers a new 10 Vp-p HPAs to 20 GHz. HYPERLABS' broadband component designs include amplifiers, baluns, bias tees, pickoff tees, DC blocks, power dividers, power splitters, attenuators, terminations and more. In particular, the company was showcasing the HL5897, a linear amplifier and data driver with a bandwidth of 48 kHz to 63 GHz and the HL5887, a thermally-compensated linear amplifier with a typical bandwidth of 42 kHz to 40 GHz. HYPERLABS also has a growing instrumentation product line that includes cable skew testers, TDR/TDT, impulse generation, impedance analyzers and more.

iCana

iCana is a fabless semiconductor component supplier company for the wireless telecommunication infrastructure market. iCana has been transforming its IP portfolio in a range of key products in different semiconductor technologies to support the 5G market and its evolving ecosystem. The company has headquarters in Taiwan and provides III-V semiconductor component solutions and reference designs, They also have a team in Belgium that primarily addresses Si-CMOS innovation and design solutions leveraging the use of cost-efficient technology integration platforms needed for the 5G mmWave market.

Their sub-6 GHz product range is comprised of high-power amplifiers, driver amplifiers, low noise amplifiers, front-end modules and control components, including switches, attenuators, and limiters. For mmWave applications, the company is developing beamforming ICs and integrated front-end modules. The products cover the most important 5G frequency bands.

Indium Corporation

Indium Corporation® featured its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at IMS. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion and oxidation-resistant solder joint possible.

iNRCORE

iNRCORE featured Product Lines from their entire family of brands. This includes Conical Inductors, Chip Inductors, RF Filters, Transceiver Modules, Current Sense Transformers, Ethernet Transformers, Common Mode Chokes, Planar Transformers, Power Inductors & Transformers, Resistors, Capacitors - Custom and Standard - QPL & COTS. 

International Manufacturing Services Inc

International Manufacturing Services Inc. exhibited in booth 1945. Attendees can learn about IMS’s latest developments in passive thick- and thin-film components, including surface-mount-technology (SMT) resistors, attenuators, couplers, splitters and thermal management devices.

Visitors were able to learn more about high-thermal-conductivity aluminum-nitride (AlN) attenuators and resistors, optimized for: low duty cycle pulse; higher power, and; improved thermal transfer. They can also learn about both electrically isolated, board-level SMT thermal management devices, and; a range of nonmagnetic components that lend themselves well to medical applications.

JARIET Technologies 

JARIET Technologies demonstrated ELECTRA at IMS in booth 2326. The ELECTRA architecture, already well established in the aerospace and defense market, is now being offered as a family of commercially available IC’s to enable broader customer access to JARIET’s leadership technology in a stand-alone package with an industry standard SERDES data interface. The common architecture and software environment used across the entire ELECTRA family reduces customer development cost and enables faster time to market while addressing multi-function and multi-domain application spaces. The 36 GHz bandwidth enables software-defined radio (SDR) at double the frequency previously possible and with signal instantaneous bandwidth (IBW) up to 6.4 GHz wide per converter. ELECTRA more than triples the clock rate of the nearest competitor’s ADC and  more than doubles the nearest DAC. The 10-bit 64 GSPS ADCs deliver 10 dB better noise spectral density and 17 dB better noise figure at 9.5 GHz than the best 14-bit ADCs.

Junkosha

Junkosha showcased its extensive range of high frequency cabling solutions at IMS. Making its debut is the new metrology-grade MWX871 cable, designed for specialized applications such as vector network analyzer (VNA) calibration tests, delivering the highest accuracy measurement for frequencies up to 70 GHz. The assembly has good performance durability surpassing 40,000 tick tock cycles during testing. Alongside this latest product, Junkosha featured its ultra-phase stable cable line-up designed to meet the higher frequency demands of tomorrow’s 5G/6G networks.

Keysight Technologies

 Keysight’s microwave and RF experts showcased solutions that accelerate spectrum innovations to help customers optimize 5G and pioneer 6G. Keysight presented the following demonstrations that are accelerating spectrum innovations:

• Wideband Active Load-Pull – Showcases Keysight’s newly introduced wideband active load-pull (WALP) capability using a dual-channel VXG-C vector source and a PNA-X network analyzer to demonstrate the error vector magnitude performance of a power amplifier when presented with arbitrary frequency-dependent load impedances created without an impedance tuner.
• AI/ML Enabled EDA – Demonstrates Keysight’s ADS 2025, which offers 3D Circuit-EM-Thermal multi-physics co-design, high-performance automation enabling AI/ML and robust design validation for RF and millimeter-wave, and provides support for wideband power amplifier design techniques, including nonlinear load-pull. Also shows how PathWave System Design 2024 U1 links to ADS through the new RF System Explorer as well as how ADS provides new communications PHY technology for 5G NTN systems design, while enabling training and use of AI/ML-based models, channels, provides RF-true phased array design for 5G and 6G systems.
• Phased Array Antenna Test – Showcases Keysight’s phased array control and calibration test solution inside the Vertical Compact Antenna Test Range, which accommodates a wide variety of phased array antenna performance verification tests including fast gain and phase calibration, effective isotropic radiated power, antenna radiation pattern, antenna gain-to-noise-temperature (G/T), modulation distortion and radio frequency to direct digital measurements.
• Signal Source Characterization – Demonstrates how to perform sub-THz phase noise measurements with Keysight’s new E5058A 54 GHz SSA-X signal source analyzer and an E5051AW phase noise measurement down-converter for 6G applications and microwave amplifier residual phase noise and AM noise measurements.
• IQ Data Characterization – Highlights how Keysight’s vector signal analysis software uses a new feature to precisely characterize a homodyne (IQ) system by characterizing and digitally correcting the frequency-dependent dispersion and imbalance of a Marki IQ mixer.

Knowles Precision Devices

Knowles Precision Devices is a specialty components manufacturer that tackles the challenges inherent in high-reliability, high-temperature, high-performance and high-frequency solutions. They adhere to the highest military-grade quality and reliability standards at their US-based manufacturing facilities so that components are qualified for use in even the most sophisticated and secure military and aerospace applications. 

The Knowles microwave product portfolio includes custom designed and build-to-print solutions to meet the needs of aerospace and defense customers. 5G catalog filters at 26, 28, and 39 GHz provide 3 GHz of bandwidth, > 50 dB rejection, are 20x smaller and are temperature stable from -55°C to +125°C. Additionally, our single-layer capacitors support microwave and mmWave applications up to 100 GHz. The company was showing the full range of their product portfolio.

Kratos Microwave USA

Kratos had an extensive portfolio of power amplifiers covering 1 to 50 GHz with power levels ranging from 50 W CW to 2 kW pulsed for aerospace, defense, and instrumentation customers. Their capabilities extend into integrated microwave assemblies supporting various radar, EW and communications applications meeting unique mission specific electrical and environmental requirements. New product development in 2024 focused on frequency coverage of V- and W-Bands.

Kratos GaN SSPAs:•  Small Form Factor•  Decoys & Expendables•  SAR, TCDL, UAVs•  AESA Radar Systems•  EW: ECM, ECCM & ESM

MACOM 

MACOM highlighted more than 14 technology demonstrations at the show, spanning its various product lines, including diodes, RF power, MMIC and linear modules and subsystems. The booth featured the latest new product additions to the company’s broad product portfolio. MACOM also highlighted its expanded foundry services offerings at the show. Customers and attendees will have the opportunity to engage with MACOM’s design engineering, product management and applications engineering teams who will provide in-depth explanations of MACOM’s solutions and benefits.

IMS2024 demonstrations and new product announcements included:

• GaN-on-SiC MMIC Ka-Band Power Amplifier: This demonstration showcased a 6 W driver and a 10 W PA operating in the 33 to 37 GHz band. These parts are fabricated using MACOM’s 140 nm GaN-on-SiC technology.  
• 300 W X-Band GaN-on-SiC Matched Power Amplifier: A new addition to the MACOM RF product portfolio, this amplifier is fully matched to 50 Ohms at both input and output ports. Ideal for pulsed radar applications such as marine, defense and weather radar, it provides an ideal combination of output power, signal gain and drain efficiency in a small form factor at 9 GHz.
• C-Band 100 W GaN-on-SiC Power Amplifier with 57 percent power-added efficiency (PAE):  This GaN Power Amplifier combines high gain and high efficiency for pulsed power applications within a small footprint (7 x 7 mm). This demonstration also featured MACOM’s XP1044 driver amplifier and MACP-011113 surface mount directional coupler.
•  250 W 2.4 to 2.5 GHz High Power GaN Pallet: This two-stage GaN Amplifier Pallet, part of MACOM’s recently expanded range of RF solutions, is tailored for industrial, scientific and medical  applications. This turnkey solution features the industry’s most efficient microwave CW transistor in a plastic package, enhancing cost effectiveness.
• GaN-on-Si MMIC Low Noise Amplifier (LNA) with Fast Recovery Time:  By utilizing MACOM’s proprietary 100 nm GaN-on-Si technology, MACOM delivers robust low noise LNAs with industry-leading recovery time. This combination of ruggedness, low noise figure and fast recovery time make these LNAs ideal for radar and electronic warfare applications.
• GaN Switch: This demonstration displays MACOM GaN-on-Si switch solutions highlighting a C-Band GaN switch with a P0.1dB of greater than 50 W. In addition, the company’s latest high frequency GaN-on-Si switch offerings were on display.
• Linearized Q-Band GaN PA MMIC for SATCOM: This demonstration highlights MACOM linearizer technology. Combining a Q-Band GaN-on-Si amplifier, designed for satellite communications, with a wideband analog linearizer, MACOM showed how it is possible to simultaneously achieve optimal linearity, PAE and output power for SATCOM.
• Quad L-Band to Ka-Band Block Up-converter: This integrated solution offers excellent phase noise performance, an analog or digital interface and low sensitivity to microphonics. It simplifies system linearity and provides benefits in terms of cost, size, mass and complexity.
• X-Band T/R Module (TRM) with 42 percent PAE: Designed for X-Band aerospace/defense applications, this demonstration highlights MACOM’s WSM5100S multi-chip module which integrates a high power GaN Switch, GaAs Limiter-LNA and GaN PA into a 7x7 mm QFN. This TRM delivers 5 W Output Power with industry-leading efficiency.
• High Power Reflective SP2T Surface Mount Switch: Ideal for applications requiring high RF power and surface mount capability, this switch operates between 30 MHz and 5 GHz. It offers high CW power handling up to 200 W along with excellent insertion loss and switching speed, all within a compact package.
• Broadband High Power Limiter: With an operating frequency of 2 to 18 GHz and peak power handling up to 1 kW, this RF limiter provides exemplary frequency, insertion loss and high power performance to meet the necessary requirements for receiver protection as well as ship and airborne radar applications.
• High Power SOI Switch: This switch features low insertion loss and a symmetric topology, along with excellent linearity, making it perfectly suited for high performance communications systems. The demonstration utilizes a CMPA2060040D1 amplifier as a driver stage and a MACP-011113 surface mount directional coupler to highlight the SOI switch’s high compression level.
• Integrated Filter Technology/Switched Filter Bank: This demonstration showcases MACOM’s various filter technologies and MACOM’s capability to integrate filters with other functions (in this case switches) to created switchable filter banks. This demonstration showed bulk acoustic wave, GaAs and Laminate filters highlighting the strengths of each technology and the potential integration options offered by MACOM.
• Space and Hi-Rel Products: MACOM will exhibit a wide range of space and high reliability (Hi-Rel) components and capabilities for free space optics systems, including lasers, laser drivers, various photodiodes and transimpedance amplifiers (TIAs). In addition, the MACOM team presented examples of various RF-over-fiber analog photonic subsystems used in high performance satellite communication applications.

In addition to the product showcase, attendees learned more about MACOM’s enhanced foundry services. 

Marki MIcrowave

For over 30 years, Marki Microwave has been creating a portfolio of RF and microwave components. Founded in 1991 with the goal of developing the best mixers in the industry, today Marki Microwave is a single source for high-performance, broadband microwave products. Their products support multiple form factors, including die, surface mount and connectorized solutions for the entire RF block diagram from DC to sub-THz frequencies. In addition to its broad range of component solutions, Marki Microwave was featuring its Prodigy Filter Designer software products that it makes available to designers on the website. The have a CSP Family for ultimate space saving solutions including 1.5, 2.5 and 3.5 mm sizes.

Marvin Test Solutions

Marvin has trademarked the phrase "We Make Test Easy™"  and they were showcasing their solutions for  military, aerospace and manufacturing organizations. Marvin Test Solutions is a vertically integrated aerospace test and measurement company that has been providing test solutions since 1988. As a member of the Marvin Group, Marvin Test Solutions has test systems deployed worldwide in support of most of the major military aircraft and munitions in use around the world. Their test solutions support the maintenance and sustainment of military aircraft including the F-35, F-15, F-16, F-18, TA-50, FA-50, F-5, Hawk, RPAs, and their associated precision-guided munitions. In addition, Marvin solutions are deployed in the commercial aircraft, transportation, space, and semiconductor manufacturing markets.

MathWorks

In addition to hosting a variety of demos at booth, MathWorks experts lead workshops and educational seminars with industry leaders throughout the event. IMS2024 attendees had the opportunity to discuss several wireless communications workflows with MathWorks experts including exploring 6G waveforms, including over-the-air testing with MATLAB; wideband radar and communication waveform classification with Universal Software Radio Peripherals; 5G waveform design and validation using MATLAB and Keysight test equipment; and measuring RF filters with Keysight VNA, creating MATLAB behavioral models and tuning filter performance.

Maury Microwave

Maury had an extensive number of demonstrations:

Achieving high VSWR is crucial at high frequencies since passive interconnects, such as waveguide sections and on-wafer probes, experience higher loss, which reduces the maximum reflection coefficient presented to the device under test (DUT). A demo at this year's show featured the prototype NT-220G330G-1C mmWave WR3.4 impedance tuner from Maury Microwave that offers the highest VSWR on the market by a significant margin, enabling users to perform active device characterization up to 330 GHz.

MMW-STUDIO – a software suite provided by Vertigo Technologies, enables power and phase control at the DUT reference plane through the extenders – performs a power-controlled S-parameter measurement and an active load pull in the WR6.5 waveguide band (110 GHz – 170 GHz) on a waveguide connectorized amplifier.

LNA design for quantum computing, radio astronomy, and other applications that operate at cryogenic temperatures require advanced and reliable noise parameter measurement capabilities. This demonstration used a cryogenic noise parameter system, featuring the MT7553A03 noise receiver module, that can extract noise parameters down to 4 Kelvin at cryogenic temperatures while utilizing a cryogenic solid-state tuner to achieve non-50 ohm environments at the DUT input.

The MT2000 is a turnkey one-box load pull solutions that offers wideband impedance control for modulated signals over the hardware’s modulation bandwidth and performs load pull at high speeds – up to 1000 impedance/power states per minute – with no limitation on Smith chart coverage. The MT2000 mixed-signal active load pull system was demonstrated as it performed load pull on an LNA.

Modern m-QAM, OFDM systems exhibit high PAPR. If the peaks are suppressed due to amplifier nonlinearity, symbol and bit errors may occur. Learn how the RTP5000 series USB real-time peak power sensors can provide PAPR results and CCDF curves to evaluate an amplifier's nonlinear behavior and impact on signal integrity.

The signal-to-noise ratio (SNR) and carrier-to-noise (C/N) ratio can quantify a system’s tolerance to complex noise, providing insight into its real-world performance. With the UFX7000B, controlled additive white Gaussian noise (AWGN) can ensure the performance designed in the lab is realized in the field. Related power measurements are captured and analyzed by RTP5000 sensors and the PMX40 benchtop RF power meter.

Today’s communication systems utilize high order modulation to achieve high data throughput, which requires faster clock rates that can increase symbol errors. A potential source of these errors is phase noise from the existing local oscillator (LO). This demonstration featured the HSX9000A series of multi-channel RF synthesizers with the ultra-low phase noise option as an ideal LO substitute, and the HA7062 series for real-time phase noise analysis.

The leading-edge capabilities of the ACE9600 Advanced Channel Emulator, a non-terrestrial RF channel emulation solution that simulates link and hardware-based impairments on a signal’s path. Using its advanced emulation capabilities, the ACE9600 showed how real-world operating conditions impact signal constellation and other spectrum measurements.

In an in-booth demo at IMS, a vector-receiver source-pull and load-pull setup will utilize two Nano5G™ tuners to manipulate source and load impedance and optimize the performance of a high-frequency, high-power device. The Nano5G model enables highly reliable passive load pull measurements for 5G applications, especially in the 28 and 39 GHz bands allocated for FR2, although continuous operation is available from 18 – 50 GHz.

MCV Microwave

MCV Microwave exhibited  in Booth #342. They hosted live demonstrations and showcased new products for mission-critical applications.

Live Demonstrations

• Consistent performance of 10.7 MHz filter for audio and visual equipment.
• Ultra-narrowed band 5G filter with high rejection 500 kHz from passband edge.
• GPS cavity notch filter and L1/L2 ceramic duplexer for LTE signal suppression.
• 5G C-Band ceramic filter for radar altimeter.

Product Portfolio

• Ceramic Patch Antenna for Wi-Fi, Globalstar and GPS applications.
• Metallized Ceramic Substrates and Single Layer Capacitors (SLC).
• Precision tuned Ceramic Resonators.
• High Performance Cable Assemblies.
• Cavity Combiners.
• Ceramic Monoblock and Waveguide Filters.
• Lumped Element Filters and Integrated Assemblies.
• Passive Components

Menlo Micro

Menlo Micro exhibited the breadth of its market applications. They have adopted the goal of "Optimize the electrification of everything" with the tagline "From milliwatts-to-kilowatts. From DC-to-GHz," and their product displays and demonstrations supported that vision. In particular, they had an enormous printed circuit board that contained a very large FPGA and many of their Ideal Switches for use in AI applications. The company continues to expand its presence in RF switches and subsystems, relays and power management devices for commercial and defense, test and measurement and medical RF applications, along with power switching and control applications.

Mercury

Mercury was displaying the edge-ready signal technologies of what they call the Mercury Processing Platform. These products and capabilities are used for DRFM jamming, digital signal processing, electronic attack simulation, beamforming, real-time signal monitoring, satellite communications, software defined radio, and other applications. Their microwave products include MMIC devices, switch matrices, DIFM receivers, custom IMA solutions, RF microwave converters, Direct RF boards and more. These solutions are designed to meet engineering requirements and challenges commonly encountered in aerospace and defense systems. They were discussing their MMIC capabilities and products and how they leveraged those into their higher order assemblies.

Microsembly

Microsembly's mission is to bridge the engineering-manufacturing gap to deliver high-quality microwave products and services. Whether low or high-volume production, assembling straightforward builds or highly complex integrated modules, they are ready to partner on your next project. By actively collaborating with customers, they gain an in-depth understanding of even the most unique requirements for demanding applications. This partnership approach guarantees tailored solutions that precisely align with your expectations. Their focus is delivering customized microwave modules and subsystems that meet your exact specifications. Microsembly's expertise is in RF/microwave design, quick turn prototyping, and scalable contract manufacturing.

Micro Harmonics Corporation

Micro Harmonics specializes in the design and manufacture of advanced ferrite components including Faraday rotation isolators, hybrid circulators, voltage variable attenuators, cryogenic isolators, and Y-junction circulators. Their products cover every standard waveguide band from WR-28 (26-40 GHz) through WR-2.8 (260-400 GHz). These products exhibit low insertion loss, broad bandwidth and what MHC claims is the highest frequency coverage in the industry. MHC uses diamond heatsinks for improved power handling and reliability. Their patented hybrid circulators offer unprecedented bandwidths at mm-wave frequencies and their compact variable attenuators have a 35 dB dynamic range.

MilliBox 

MilliBox had several demonstrations displayed during IMS. Four demonstrations were shown at MilliBox booth 705 and three others by partners.

Booth 705: MilliBox unveiled its new Compact Antenna Test Range system MBX32CTR. It consists of an MBX32 chamber, a GIM04-300E positioner and with the addition of a parabolic reflector and probe, it eliminates the far field distance constraints.  MilliBox demonstrated its innovative approach to mmWave radar sensor testing with the combination of MBX32R chamber, GIM04-300X 3-axis antenna positioner and LIN04 linear actuated radar target controller. MilliBox showcased MBX03 chamber with GIM05-340, a Spherical Roll 3-axis positioner, capable of native 3D radiation pattern with very wide unobstructed view angle. Finally, Millibox showed the benefit of using the StabilityPlus line of RF cable assemblies from Maury Microwave for routing mmWave signals to a device under test mounted on MilliBox GIM04-230X 3-axis antenna positioner. 

Booth 1939: Eravant showed its integration of MilliBox GIM04-300E for its new Open Bed Compact Range with 150 mm of quiet zone. The use of a 3D positioner for this application allows for OTA measurement of a high precision 3D radiation pattern. Because GIM04-300E can mount sub-THz frequency extenders, this solution is suitable for measurements from 24 GHz to 170 GHz.

Booth 1111: Copper Mountain Technologies showed its new OTA-2H completely integrated OTA test system developed in cooperation with Eravant and MilliBox. MilliBox contributes a full chamber MBX32 and a positioner GIM04-300E, Eravant contributes the frequency extenders from the STO series up to 220 GHz, and Copper Mountain Technologies supplies the USB VNA Cobalt 4209. This constitutes the most accessible full OTA system package on the market.

Mini-Circuits

For more than 55 years, Mini-Circuits has been supplying RF, microwave and millimeter wave products. From communications networks and critical national security systems to life-saving diagnostic imaging, quantum computing and much more, the company enables a faster, smarter, more connected future with the power of RF, microwave and millimeter wave technology. Headquartered in Brooklyn, NY with design, manufacturing and sales locations around the world, Mini-Circuits supports the electronics industry with a broad range of active and passive components, along with a variety of test solutions that were on display in Booth #1639.

Mitsubishi Electric Corporation 

Mitsubishi Electric exhibited its new 16W GaN PAM at IMS2024 in booth 1143. In September 2023, Mitsubishi Electric began providing samples of a GaN PAM that achieves an average output power of 8 W (39 dBm) over a wide frequency range from 3.4 to 3.8 GHz, suitable for 64T64R mMIMO antennas of 5G base stations. The 16 W (42 dBm) GaN PAM announced today achieves even higher average output power over a wide frequency range from 3.3 to 3.8 GHz and is suitable for 32T32R mMIMO antennas, extending the communication range of 5G mMIMO base stations and lowering their manufacturing cost by reducing the required number of PAMs.

mmTron 

mmTron staff discussed the expanding product line of MMICs that are extending system capabilities in fixed wireless access (FWA), satellite communications, aerospace and defense and instrumentation. At IMS, mmTron announced a full IF to antenna solution for 25 to 29 GHz FWA, offering high EIRP for 400 MHz, 1024-QAM systems. Discussing mmTron’s unique approach to optimizing power, linearity and efficiency, Michael Roberg, mmTron Engineering Fellow, presented an invited keynote, “GaAs & GaN MMIC Power Amplifier and Front-End Module Design for K-Ka Band Commercial Communication Systems” on Wednesday, June 19 (session We1C-1).

Molex

Molex highlighted their latest technologies such as 5mm circulators, their Cardinal Test cables and one that is a very innovative product, the MMCX Power over Coax.  They have addressed a long standing issue with the MMCX when trying to drive low voltage power over coax for sensors or video chips.  The standard MMCX plug uses a half-round snap ring in a groove that allows movement of the mated connector pair.  This can cause intermittent power levels.  If the sensor or video application is critical, this becomes a major issue.  Things like automotive full display LCD mirrors, driver monitoring cameras or industrial sensors are some key applications we have seen. Molex has developed a new spring mating technique that eliminates the intermittent condition even when mated with industry standard MMCX PCB jacks.

Naprotek, LLC

Naprotek showcased its advanced electronics manufacturing capabilities at booth #2105. Complementing Naprotek’s core offerings in printed circuit board assembly and box build, SemiGen combines a deep technical expertise in RF/microwave microelectronics manufacturing and test with a suite of build-to-print thin film and discrete semiconductor products, providing a full spectrum of advanced manufacturing capabilities. Manufacturing experts from both Naprotek and SemiGen were available at the exhibition booth to discuss current and future programs with original equipment manufacturers.

Nuvotronics

Cubic Corporation's microelectronics business, Nuvotronics, exhibited at IMS in booth 427. Their products on display included:

• Filters:  Provide narrowband machined filter or wideband performance, employing the PolyStrata® suspended substrate technology in an easy to integrate surface mount form factor with a 100x smaller volume than conventional low-loss filters.
• Combiners:  Provide superior performance for solid state power amplifiers for both ultra-broadband and mmWave applications. Delivered in a surface mount form factor, 100x smaller volume at 1 percent of the weight compared to conventional waveguide combiners.
• Couplers:  Provide dramatic size, weight and performance advantages in surface mount form factors with a 6–10x size reduction.
• PolyStrata® mmWave Packaging Technology:  Provide low-loss interconnects to packaged MMIC and PCB transmission lines with ultra-wideband performance (15 to +100 GHz) and high thermal connectivity (400 W/m.K). The patented PolyStrata® process, uses a unique 3D additive manufacturing copper air-dielectric process to create mmWave devices with an unprecedented level of RF performance, integration and miniaturization, achieving a 10x to 100x improvement in size, weight and power.

Nxbeam

Nxbeam is a millimeter-wave fabless semiconductor company building proprietary semiconductor IC products for the satellite and 5G wireless infrastructure markets. By focusing on higher frequency (mmWave) and wider bandwidth products and designing for higher fidelity, Nxbeam’s IC solutions offer higher data throughput, providing customers with a greater ROI. Nxbeam‘s series of high-fidelity power amplifier ICs addresses the satellite ground terminal market and its line of multi-function high data-rate transceiver products target the satellite radio market.

Optical Zonu

Optical Zonu Corp. was at its first IMS Show, and they were discussing their solutions and capabilities in Booth 2162. The company provides a whole host of modules, subsystems and delay lines that provide transport capacity for applications by using an RF-over-fiber (RFoF) concept. Since the transport mechanism is fiber, the RFoF concept provides many benefits in harsh environments and applications that are space-constrained. The company targets its solutions to a broad range of commercial, public safety, space and defense wireless and wired transport applications.

Pickering Interfaces

Pickering Interfaces showcased its extensive range of RF and microwave switching, including SPDT, transfer, MUX and matrix switches with bandwidths from DC to 110 GHz, available in PXI, LXI and USB – as well as its new family of high channel count PXI/PXIe microwave multiplexer (MUX) modules – at booth 404 at IMS.

Pickering’s new high channel count microwave MUX family (models 40/42-788) is based on superior-quality Radiall mechanical microwave switches, with bandwidth options from 8 GHz to 40 GHz, and versatile switching configurations, including single or dual SP8T, SP10T or SP12T multiplexers. As well as microwave switching applications, the modules also suit many uses across the RF spectrum where extremely low insertion loss and ultra-high isolation are critical.

In addition to the new high channel count microwave MUX modules, Pickering highlighted the following RF and microwave switching solutions:

• MEMS-based PXI/PXIe RF multiplexers that deliver 300x operational life and 60x test system throughput compared to existing electro-mechanical relay products
• 110 GHz PXI/PXIe microwave switch – supporting 5G and semiconductor test
• A configurable PXI microwave switch platform that allows RF test engineers to combine a wide range of high-performance relay types while minimizing chassis slot usage
• Microwave Design Tool – a free online tool for configuring flexible PXI & LXI microwave switch products
• Flexible LXI microwave switch platform and turnkey services for LXI microwave switch and signal routing subsystems – including an LXI microwave switching matrix demo
• A selection from Pickering’s broad portfolio of other switching and sensor simulation products, along with its PXI, PXIe and LXI/USB modular chassis and supporting cables and connectors.

Pendulum Instruments

Pendulum has roots back to the 1950s, when the company was the Swedish branch of Philips Test & Measurement division. Pendulum Instruments was spun-off in 1998. Pendulum was showing and discussing their products for precision timing/frequency applications that target metrology, aerospace and defense, telecom, oscillator manufacturing, RF and microwave, electronic industries, contract manufacturing and automotive industries. The company was spotlighting its line of CNT-102/104s multi-channel frequency analyzers.

pSemi 

pSemi demonstrated a number of its industry-leading solutions across infrastructure, connectivity, antenna and high performance multimarket applications at its booth #1351, including a turnkey sub-6 GHz RF front-end (RFFE) reference design that was created in collaboration with AMD and Murata. This new platform solution, built to meet the needs of the modern mobile infrastructure network, joins pSemi and Murata’s RFFE reference design with the AMD Adaptive Radio SoC, the Zynq™ UltraScale+™ RFSoC DFE. Integrating the pSemi PE42446, a HaRP™ technology-enhanced SP4T RF switch, the PE53231, an integrated dual-channel switch LNA module, and PE43712, a RF digital step attenuator (DSA), the reference design delivers best-in-class RX at 400 MHz aggregated bandwidth with exceptional linearity, noise figure and industry-leading uplink performance.

pSemi also demonstrated the following advanced high performance mixed-signal solutions during IMS:

• An ultra-high voltage RF switch designed for broadband RF applications to handle the industry’s highest peak voltage (Vpk). Its compact size with superior linearity, high isolation, and low insertion loss (IL) make this customizable Nx SPxT switch configurable for a variety of applications like antenna / aperture tuning, tunable filters / harmonic traps, and fully selectable switching.
• An n104 band RFFE reference design solution using the pSemi PE44951 highly integrated two – way phase shifter with DSA.
• A 2.4 GHz IoT connectivity solution system using a Nordic SoC development board with the pSemi PE562212 high performance, fully integrated front-end module.
• Two ultra-wideband (UWB) solutions—the PE423211 and PE42545—showcasing broadband frequency coverage and low-power consumption ideal for battery-powered devices and power-sensitive applications. PE423211 boasts an industry-leading current consumption, while PE42545 has ultra-high frequency performance capabilities, both valuable for in-cabin monitoring systems and RF-based sensors.
• pSemi mmWave beamforming solutions—PE128310 and PE188210—for FR2 integrated system applications.
• An antenna reference design integrated with beamformer and up-/down-converter (UDC)/mixer for mmWave beamforming solutions.

Q-Tech Corporation 

Q-Tech announced its expanded offering of high-stability microprocessor compensated (MCXO) and oven-controlled (OCXO) crystal oscillators. Designed for reliable operation in New Space (low earth orbit) satellite timing and frequency generation applications, the QT2021 Series of MCXOs and the AXIOM75Sx Series of OCXOs meet the critical radiation tolerance specifications required for LEO deployment. The devices in both series offer a wide range of standard frequencies; the QT2021 MCXOs from 10 MHz to 100 MHz and the AXIOM 75Sx OCXOs from 10 MHz to 400 MHz. All are available with either Sine Wave or CMOS logic outputs.

Qorvo

Qorvo announced announced three new MMIC power amplifiers designed specifically for Ku-Band satellite communications terminals. These products are the latest additions to a family of devices designed to enhance performance and efficiency in satellite uplink systems, supporting the growing demand for high speed data communications in defense and aerospace applications. The output power of the amplifier family ranges from 8 W to 55 W, providing flexibility to choose the optimal power required for each specific requirement.

Product Highlights

• QPA1314: This high-power MMIC amplifier operates in the 13.75 to 14.5 GHz range, delivering a saturated output power of 55 W and a linear power of 20 W with 25 dBc third-order intermodulation distortion products. It is packaged in a 15 x 15 mm bolt-down configuration with a copper base for superior thermal performance and reliability. With a large signal gain of 22.5 dB and 30 percent power-added efficiency, it is ideal for both commercial and defense SATCOM and radar applications. 
• QPA0016: Designed for applications requiring 15 W of output power, this amplifier combines high efficiency with a compact 7.5 x 5 mm SMT package, making it well suited for a variety of satcom terminal designs.
• QPA0015: This amplifier delivers 8 W of power in a 7 x 4.5 mm SMT package for high-throughput ground and mobile terminals, offering a balance of power, size and efficiency.

Qorvo also launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. The new modules leverage Qorvo’s advanced packaging and optimal process technology to deliver the compact size, superior performance, lower noise and reduced power consumption needed for modern phased array and multifunction radar systems.

Key Features and Benefits:

• QPF5001 12 W X-Band front-end module: Combines a power amplifier, low noise amplifier and limiter in one compact module, reducing the board area by approximately 50 percent compared to discrete component solutions
• QPM2101 S-Band Receive variable gain amplifier (VGA) MCM: Integrates an LNA, 6-bit digital step attenuator, Rx buffer and T/R switch, delivering a 40 percent reduction in board area
• QPB1029 L-Band filter bank MCM: Integrates two switches on both sides of eight filters and a bypass. Housed in a 10 x 10 mm package, it is the industry’s smallest L-band radar eight-channel switched filter bank, enabling radar designers to achieve size, weight, power and cost (SWaP-C) goals.

The Qorvo booth featured their products and activities in the wireless infrastructure activities along with their foundry and services capabilities.

Quantic® Electronics

Quantic® Electronics, a portfolio company of Arcline Investment Management, recently completed the acquisition of M-Wave Design, a leading supplier of ferrite-based RF and microwave components for aerospace, defense and quantum computing applications. M-Wave was featured in Quantic Electronics’ booth.

Reactel 

Attendees saw Reactel's full line of application-specific filters, multiplexers and multifunction assemblies up to 67 GHz. Along with learning about their latest filter innovations, attendees could enter the I Got Pantsed contest and qualify to win a bevy of Maryland-themed items. Also available was the new Short Form Catalog for an overview of their extensive filter portfolio. Bandpass, lowpass, highpass and notch filters are available in an array of topologies such as tubular, LC, cavity, waveguide, ceramic and suspended substrate. Application specific multiplexer and multifunction assemblies are available as well.

Remtec

Remtec Incorporated recently completed its new, 55,000 sq. ft. facility in Canton, Mass. New capabilities that directly result from the move are: increased capacity and processing speeds for Remtec’s existing proprietary solutions; advanced dicing and laser trimming systems; photoimaging, laser etching, laser ablation and like systems; and an array of other new manufacturing infrastructure and process capabilities. Remtec was in booth 2215. 

RF SPIN

RF SPIN's booth, 1149, held their antenna designer team and the owner of RF SPIN. Visitors were able to explore the entire range of cutting-edge antenna solutions, including their new patented lens antennas. A team of experts were available to provide detailed insights into their technologies and answer any questions. RF SPIN recently launched its groundbreaking lens antenna product line. The line features three dual-polarized and four single-polarized lens antennas, operating across a broad frequency range of 730 MHz to 40 GHz. The patented 3D-printed lens technology allows these antennas to achieve an unprecedented increase in antenna gain of up to 6 dB.

RFOptic

RFOptic, Inc. showcased its RFoF and ODL solutions, including live demo, in its booth #1306. On display were its advanced RFoF and ODL solutions for electronic warfare, radar, 5G testing and DAS applications and RFoF for 5G applications. 

Rigol

Rigol offers digital and mixed-signal oscilloscopes, spectrum analyzers and RF signal generators, arbitrary waveform generators, sensitive measurement products, and data acquisition systems. Their solutions target applications like technical education, embedded design, Wi-Fi integration, EMC and manufacturing.

Rohde & Schwarz

Rohde & Schwarz allowed visitors to explore RF and microwave testing solutions at the Rohde & Schwarz interactive Measurement Playground. Trade show attendees will learn to work with versatile instruments that adapt to customers’ evolving needs. Rohde & Schwarz displayed a range of both new and familiar products including the updated R&S SMW200A vector signal generator features a sleek design, enhanced performance, and unparalleled flexibility to meet the most demanding EVM requirements. Additionally, Rohde & Schwarz presented the new R&S SMB100B RF and microwave signal generator, which delivers outstanding spectral purity and impressive output power, reaching up to 40 GHz. This advancement redefines purity and power in the midrange-class. The highly anticipated R&S SFI100A wideband IF vector signal generator was on display, designed to pave the way for groundbreaking 6G and sub-THz applications. The R&S ZNA vector network analyzer was showcased in a 6G D-band system and component characterization. For those tackling real-world testing challenges, the R&S IRAPS™ provides an excellent solution to capture, analyze, and playback real-world RF spectrums for efficient and insightful platform verification, ensuring you overcome the complexities of real-world testing. Rohde & Schwarz also presented a demonstration of the characterization of the TX/RX multi-antenna chip (CHARM) operating at up to 140 GHz using the D-Band OTA test solution.

Saetta Labs

Saetta Labs is a relatively new company, founded in 2020 by Jason Breitbarth, the previous founder of Holzworth Instrumentation. Jason was on hand to discuss and show the company's Sapphire-load cavity oscillator and discuss plans for the roadmap of that product and capability.

Samtec 

Samtec introduced its newest phase and amplitude stable Nitrowave™ cable assemblies. Demos in the Samtec booth and in partner booths across the show floor included Samtec’s LL043 43.5 GHz and LL071 71 GHz microwave cables in their distinctive orange color.  Another live demonstration featured the newly available BE90A (rated to 90+ GHz), the latest product in the popular Samtec Bulls Eye® high performance test assembly series that features a high-density space-saving design for use on smaller evaluation boards with shorter trace lengths.

Samtec’s ganged Magnum RF® product, featuring industry leading density and novel configurations, was shown in support of mmWave applications. Samtec has also released a new line of RF edge launch connectors spanning DC to 67 GHz with a narrow body design that is 33 percent smaller than traditional edge launch connectors. Interface types include 1.85 mm, 2.40 mm, and 2.92 mm.

SIGLENT Technologies

SIGLENT founders began developing digital oscilloscopes in 2002. After more than a decade of research and development, their products include digital oscilloscopes, handheld oscilloscopes, function/arbitrary waveform generators, DC power supplies, digital multimeters, spectrum analyzers and other general test instruments. SIGLENT is ISO 9001:2015 and ISO 14001:2015 Certified for its product quality and environmental management programs.

At the show, SIGLENT introduced features that extend the power of SNA (scalar network analyzer) family to material test and multiport devices. They were also showcasing their recently-released SHN900A series handheld vector network analyzer, with frequency range as high as 26.5 GHz. The piece of equipment integrates vector network analysis, time domain analysis, spectrum analysis and cable and antenna analysis into a complete RF test solution. It is specially designed for portable and flexible testing and can be widely used in field testing, R&D, production, maintenance and communication, antenna, base stations, materials and automotive electronics.

Signal Hound

Signal Hound released their first VNA. The VNA400 is a high-performance, USB-powered, 40 GHz, 2-port VNA. It operates from 40 MHz to 40 GHz with sub-Hz resolution, =/- 1 ppm internal TCXO accuracy and a sweep speed of 2000 points per second at 30 kHz RBW. Plus it is a fraction of the cost of other VNAs. There was a demo of their Phase Noise and VCO test system that enables cross-correlation phase noise floors 20-30 dB lower than the capabilities of a single SM200/SM435. They also had the RFS44, a SP4T absorptive solid-state switch, enables RF switching up to 44 GHz across four ports, supporting LF to Ka band, and facilitates pseudo-doppler direction finding with fast switch speed.

Smiths

Smiths Interconnect’s High Frequency SMPM Series Mini-Lock Connector is a 110 GHz unique insulation captivation method and compact, lightweight system with superior RF performance & reliability. Mini-Lock connector features a robust locking mechanism ensuring reliable signal integrity and perfect transmission of data between applications. Mini-Lock connector are suitable for harsh mechanical stress environments such as radars, satellites, space flight, military, and unmanned applications.

Smiths Interconnect has extended its offering of high frequency surface mount chip attenuators with the release of its new TSX Wire Bondable Fixed Chip Attenuator Series, a small, easy-to-implement, high-reliability product qualified for space and defense applications. The new TSXTSX Series WB2 Series is qualified to MIL-PRF-55342 and designed to offer excellent broadband performance up to 50-GHz, while delivering increased power handling in a small 0404 wire bondable package.

Sonnet

Sonnet was featuring it Beowulf Fast Solver which is the world's first commercial solver based on the unified-FFT algorithm. It combines FFT-enhanced fill with FFT-enhanced solve for order N log N scaling fast analysis while able to compute to full numerical precision. v19 comes out this summer with Beowulf, AL Selector for Solver and Preconditioner, Reprise License Manager and Macro Language, XML-Based File Format, Expanded Material Library, Expanded Technology Files, Streamlined Documentation and Enhanced Performance for All Solvers.

Spectrum Control

Spectrum Control launched a family of standard filters for low-pass, high-pass and band-pass applications, with custom derivatives available for any frequency requirement from 500 MHz to 10 GHz. The initial filter in the family was on display for the first time in the Spectrum Control booth. Future products will include mmWave filters and interconnects up to 300 GHz.

Spectrum Control also showcased an innovative new RF front end system-in-package (SiP) platform as part of its SCi Blocks™ family. This unique RF+ SiP breaks through size and performance barriers to deliver a complete wideband RF front end in a 30 mm² BGA package. Extensible, customizable, and digitally enabled, this platform delivers the capabilities of an integrated microwave assembly in a surface mount package. It is ideally utilized as a co-processor to Direct RF FPGAs and mixed signal control processors. It can also be used in any application where size, weight, power consumption and cost are a factor such as smart antennas.

SV Microwave

SV Microwave’s VITA and SOSA products, alongside other new products, were displayed at IMS at booth 905. SV Microwave offers a portfolio of VITA and SOSA products designed to meet the demanding requirements of modern military and aerospace applications. Key offerings include the VITA RF 67 connectors for embedded computing, lightweight VITA 67.3 aluminum connectors, hybrid VITA 66.5 RF/Fiber connectors, and user-friendly VITA 67.3 installation and removal tools. Additionally, the company provides SOSA-aligned D38999 pin and socket contacts, 75 Ω VITA 67.3 SMPM contacts and the recently-licensed NanoRF VITA 67.3 products. The NanoRF VITA 67.3 connector system includes eleven new products, including cable assemblies, backplane and plug-in cable contacts, and various VITA modules, supporting applications like SIGINT, EW suites, UAVs and UGVs.

Tabor Electronics

For over 50 years, Tabor Electronics has been involved in signal generation technology. Established in 1971, Tabor offers a range of high-end signal sources, including RF and microwave signal generators, high-speed arbitrary waveform generators/transceivers and high-voltage amplifiers.At the show, they featured the Lucid RF signal generator series and the new additions to the Proteus arbitrary waveform generators/transceivers.

The Lucid RF signal generator series is geared towards solving applications demanding high dynamic range, fast switching speed and easy remote programming for system integration, all in a compact module platform. The series was designed to offer a full product portfolio for generating signals for various applications, whether 5G, radar, communications or other applications.

Tabor’s new addition to the Proteus, arbitrary waveform generators/transceivers series has a built-in IQ modulator with advanced capabilities for multi-channel RF signal generation. The system is based on a PXIe platform and enables the user to transmit, receive and perform digital signal processing in a single instrument. The Proteus series offers an integrated numerically-controlled oscillator (NCO), digital interpolator and IQ modulator for the generation of complex RF signals directly from the Proteus instrument. The internal digital up-converter enables the direct generation of IQ modulation signals, eliminating limitations such as IQ mismatch and in-band carrier feedthrough that are present with external IQ modulators and mixers. This AWG targets multi-channel applications such as quantum physics and radar that need high performance, synchronized, phase-coherent outputs. 

Tagore Technology Inc.

At IMS, Tagore announced the introduction of the TS8728N and TS8729N asymmetrical reflective single-pole two throw (SPDT) switches designed for broadband, high-power switching applications. The new feature-rich switches offer best-in-class insertion loss, power handling, high linearity and high isolation performance and are well-suited for L- and S-Band radar and cellular infrastructure applications. The TS8728N is designed to operate at 400 W of pulse power with 2 ms pulse width and 20 percent duty cycle in S band whereas TS8729N is designed to operate at 550 W of pulse power with 2 ms pulse width and 20 percent duty cycle. Th devices operate with a single +5 V supply and switch with a single control voltage (0 to 3 V). They can be tuned to specific RF bands within the range of 0.3 to 5.0 GHz by modifying select external SMT components.

These new devices are compact, integrated high-power single-pole, double-throw (SPDT) with on board driver circuits. TS8729N can cover 500 MHz to 2.0 GHz and provide very high RF power handling & high linearity within a small package size. The TS8728N covers 0.5 to 5.0 GHz and has been optimized for switching speed.

Teledyne e2v

Teledyne displayed the EV10AS940, a 10-bit Ka-band capable single channel analog-to-digital converter allows a sampling rate up to 12.8 GSPS at IMS. It features digital down-conversion and frequency hopping capabilities with multiple digital channels thanks to the integration of multiple NCOs. The EV10AS940 is packaged with an organic substrate to allow high speed and high bandwidth operations. 

They also released the TDLNA0840SEP which is a UHF wideband low power LNA MMIC. The MMIC provides a nominal gain of 29 dB and a NF of 1.5 dB across the operating frequency range, with a power consumption of 25 mW. The RF ports are dc blocked, and matched to 50 ohms nominal. The TDLNA0840SEP will be available packaged in a 3 x 3 mm, 16-pin, plastic QFN. Typical application environments include terrestrial military, avionics, and space applications. Typical use being in phased antenna arrays for communication systems.

Tektronix 

At booth 2205, Tektronix showcased demonstrations of several cutting-edge technologies. This included viewing the complex environments created in the Tektronix Arbitrary Waveform Generator and using SignalVu-PC with the Tektronix 6 Series B oscilloscope, which delivers the functionality of a vector signal analyzer.

Times Microwave

On display, Times Microwave Systems' had their high power product lineup. Their StripFlex®, HPL, HP and HPQD™/MPQD™ connectors redefine connectivity, offering unmatched performance and durability for any application. StripFlex® provides exceptional flexibility without compromising performance, while HPL ensures reliability and efficiency in power distribution systems. HP connectors deliver robust connections for high-power applications, and HPQD/MPQD connectors offer quick-disconnect functionality and versatility.

The also featured their SiO2 cables for harsh environments. The SiO2 semi-rigid cable assemblies are used in applications demanding the ultimate in phase tracking performance and extreme environments. These cables are well suited for demanding applications such as space or quantum computing and available in several frequency ranges.

TransEON Inc.

TransEON unveiled a new MOSFET-based GaN-on-SiC process at IMS2024. The new process enables fabrication of cutting-edge transistors and MMICs with significant benefits over existing GaN HEMT technology. An official launch event took place at the Marriott Marquis Independence Salon D on Tuesday June 18, directly accessible from the Walter E. Washington Convention Center Concourse (Level C).  Staff wasalso be present at Booth 2343 on the trade show floor.

Transline Technology

Transline Technology showcased its unique proficiency in manufacturing metal-backed PCBs at IMS. These type of PCBs offer superior thermal performance and reliability, which cater to the evolving demands of high frequency applications in industries such as telecommunications, aerospace, defense, and beyond. Attendees who visited booth #733 had the opportunity to engage with Transline's team of experts, who provide insights into the company's capabilities and discuss how their metal-backed PCBs can address specific project requirements.

United Monolithic Semiconductors (UMS)

With major locations in France and Germany, our company addresses defense, space, satcom and telecommunications applications. UMS offers ASIC or catalog products based on its internal III-V technologies. Catalog products cover DC to 100 GHz, using GaAs, GaN and SiGe technologies, including power amplifiers, mixed-signal functions, low noise amplifiers, and transceiver systems. They are certified ISO 9001, ISO 14001 and IATF 16949 and the majority of its III-V internal technologies are approved for space use and part of the ESA EPPL list.

In particluar, UMS was showcasing the CHA8362-99F 27.5 to 31 GHz 25W GaN monolithic bare die HPA and the CHA6682-99F 24 to 27.5 GHz 5W  GaN monolithic bare die PA.

Virginia Diodes Inc.

VDI manufactures state-of-the-art test and measurement equipment for mm-wave and THz applications. These products include Vector Network Analyzers, Spectrum Analyzers and Signal Generator Extension Modules that extend the capability of high-performance microwave measurement tools to higher frequencies. VDI's component products include detectors, mixers, frequency multipliers and custom systems for reliable operation at frequencies between 50 GHz and 2 THz. All VDI components include in-house fabricated GaAs Schottky diodes and microelectronic filter structures.

VDI was showing some of its latest product offerings .Their mini VNA extension module is 1/4 the volume of previous versions. Generally, VDI does VNA Extenders deliver that allow for high performance network analyzer frequency extension into the THz range. Models cover 26 GHz to 1100GHz with additional bands in development. In addition to the full list of  TxRx modules, VDI also offers TxRef modules and Rx modules that deliver optimized performance for specific applications. These modules combine high test port power and exceptional dynamic range. They are compatible with most network analyzers and can be integrated into probe stations and antenna chambers. Power leveling and sweeping is also supported.  

WAVEPIA 

WAVEPIA was in booth #851, where they showcased a range of new products, including GaN MMIC PA, FEM and LNA solutions from low to Ka-Band. 

WIN Semiconductors

WIN Semiconductors showcased its compound semiconductor RF and mmWave solutions in booth 531 at IMS. WIN recently expanded its portfolio of RF GaN technologies with the beta release of a highly robust mmWave GaN on SiC technology, NP12-0B.Core to this platform is a 0.12 μm gate RF GaN HEMT technology incorporating multiple refinements to enhance DC and RF ruggedness and add die-level moisture resistance. NP12-0B integrates multiple transistor improvements providing high ruggedness when operated in deep – saturation/high-compression pulsed and CW conditions. This new rugged technology eliminates the pulse droop behavior observed in GaN HEMT power amplifiers thereby improving the range and sensitivity of pulsed-mode radar systems. Additionally, NP12 – 0B is available with the Enhanced Moisture Ruggedness option and provides excellent humidity resistance when used in plastic packages.

WIN Semiconductors also announced the beta release of a moisture rugged 0.1 µm pHEMT technology, PP10-29. Building on the mature and production proven PP10 platform, this high-performance technology incorporates WIN’s second-generation humidity resistance process, EMRII, to provide mechanical protection and moisture ruggedness at the wafer-level. To minimize added parasitic capacitance, the EMRII layers form localized air-cavities over all transistors to provide moisture resistance with minimal impact to gain, noise figure and output power. This key feature of PP10-29 mitigates amplifier performance changes from packaging, plastic encapsulation or PCB embedding, and accelerates new product development.