eBook Library
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The material presented in these PDF documents is owned by the sponsoring company and Microwave Journal®. It is presented here to be downloaded by an individual for educational purposes. It may not be downloaded from this site and reposted elsewhere.
eBooks by Topic:
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5G/6G and IoT eBooks
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Radar, EW and Sensors eBooks
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Test and Measurement eBooks
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SATCOM and GPS/GNSS eBooks
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Semiconductor Design eBooks
New eBooks:
Cables and Connectors Special Focus
The March 2025 Cable and Connector special focus eBook has articles covering new developments in interconnects for RF benchtop testing and modular connections for vehicle applications. There are product articles a new connector design for phase stability, high density connectors for testing and selecting the proper RF cable assembly. There is also a new products section.
Cable and Connector Guide to Accurate and Reliable Measurements
Exploring the latest developments in cables, connectors and testing forms the basis for the articles in this eBook. These articles will give the reader a good understanding of techniques, tips and best practices for measurement systems and the role cables and connectors play in the evolution of these systems. The first article deals solely with connectors. It offers connector fundamentals, along with five tips to optimize connector performance and ensure long-term reliability and repeatability. Some of the remaining articles address best practices and techniques for making accurate, repeatable measurements, characterizing uncertainty, improving calibration accuracy and speed and ensuring that your measurement system remains optimized. The rest of the articles discuss the critical role that cables play in measurement. They deal with requirements, theory and practical considerations involved with high-performance cable design and selection.
Optimizing PCB Designs Guidebook
Because PCBs are fundamental to electronic devices, they are used in a variety of defense, consumer electronics, telecommunications, healthcare and energy and power applications. This widespread adoption creates a significant market opportunity. However, PCB manufacturers and users must address challenges to continue to enable the mass market appeal and unique opportunities envisioned by the market forecasts and the electronics industry. These challenges and their solutions form the basis for the articles in this eBook.
These articles will give the reader a good understanding of the fundamentals and challenges of PCB material selection, design and fabrication that must be addressed to create the solutions that the electronics industry needs to evolve. The first article investigates a new composite laminate material that uses standard/qualified PTFE-based paper and glass fabric layers to provide good dimensional stability and Z-axis CTE while also exhibiting low Dk and Df. The second and last articles look at the fabrication process. The second article offers excellent insight into the fabrication steps and what is necessary at each step to optimize circuit performance. The last article addresses considerations for high-frequency RF and high-speed digital multilayer boards. The third article discusses how new materials overcome the traditional challenges presented by high Dk/low Df materials. The fourth article addresses how to reliably bend and form PCBs in response to the emergence of applications requiring 3D solutions.