www.microwavejournal.com/articles/25814-leadless-packaged-through-line-tqq7399
Leadless Packaged, Through Line: TQQ7399
January 20, 2016
RFMW Ltd. announces design and sales support for a 3 x 3 mm, leadless packaged, through line. The Qorvo TQQ7399 offers PCB designers the flexibility of an RF bypass path that can be used in conjunction with other devices or stand alone to jump existing surface traces.
Capable of operation from DC to 2700 MHz, the TQQ7399 has a typical insertion loss of only 0.15 dB while return loss is 25 dB into 50 ohms. Maximum power handling is +20 dBm.
Qorvo offers the TQQ7399 for multiple wireless infrastructure applications.