www.microwavejournal.com/articles/21979-awr-presents-and-exhibits-at-edi-con-2014

AWR presents and exhibits at EDI CON 2014

April 7, 2014

AWR will be presenting and demonstrating its soon-to-be released V11 NI AWR Design Environment™ at EDI CON 2014 in Beijing, China starting April 8 and running through April 10, 2014. V11, the first major software release in 2014, includes new features, functionality and enhancements to Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, AXIEM® 3D planar electromagnetic (EM) software, and Analyst™ 3D finite element method (FEM) EM software. Demonstrations within booth #301 will showcase V11 new features and functionality and in particular the new user-customizable PCell capability and antenna measurements within Analyst.

Additional presentations and workshops being offered by AWR and its parent company of National Instruments during EDICON include:

Date & Time	Topic & Presenter
Tuesday, April 8 1:30 pm – 1:50 pm	Effect of Pre-selection and Roofing Filters on Over-the- air Measurements
Tuesday 1:50 pm – 2:10 pm	Addressing the Challenges of Synchronization in Envelope Tracking Test Solutions
Tuesday 2:15 pm – 3:00 pm	Digital Predistortion Techniques for Mobile PA Test
Tuesday 4:15 pm – 5:00 pm	Survey of Wireless Transmitter & Receiver Metrics in Modern Wireless Standards
Wednesday 2:15 pm – 3:00 pm	Implementing Reference Designs in Microwave Office Software
Wednesday 3:30 pm – 4:15 pm	Class F Power Amplifier Design within AWR Microwave Office Software and Featuring Cree
Wednesday 4:15 pm – 5:00 pm	Intrinsic Cree GaN HEMT Models Allow More Accurate Waveform Engineered PA Designs
Wednesday 4:15 pm – 5:00 pm	Increase WLAN Manufacturing Test Throughput with Multi-DUT Test
Thursday 11:20 am – 11:40 am	Analog RF Test Methodology & Architecture for NFC Devices
Thursday 11:20 am – 11:40 am	High-frequency PCB Design and Analysis: Cross-platform Flows/Solutions
Thursday 11:40 am – 12:00 pm	An Integrated Electro-thermal MMIC/RFIC Design Flow
Thursday 11:40 am – 12:00 pm	Comparison of the EMVCo and ISO18047 Power Calibration Method
Thursday 1:30 pm – 2:15 pm	Combining Planar and 3D EM Simulators for RF Interconnect Analysis: Techniques for Better Results
Thursday 2:15 pm – 3:00 pm	EDA Design Flow Panel
Thursday 2:15 pm – 3:00 pm	The Future of Telecommunications Technology Panel

Where:

Booth #301

EDICON 2014 - Beijing International Convention Center

Beijing, China

When:

April 8, 2014 through April 10, 2014