Articles Tagged with ''copper''

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced ICA LITE, a ½” aluminum plenum-rated wideband coaxial cable designed to deliver outstanding electrical performance and support all wireless in-building applications. A cost-effective alternative to copper cabling, it maintains compatibility with existing connectors, tools and hanging hardware for easy and convenient installation.

Pulse Electronics Corp., a leading provider of electronic components, introduces a new VDSL2 30MHz transformer that is compliant for use with the Lantiq Vinax V3 chipset family. The BX4290LNL and BX4290LNLT transformers are used with the Class AB line driver to deliver high bandwidth over existing copper transmission lines. These transformers have improved longitudinal balance and provide excellent total harmonic distortion performance on a very compact platform. 

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board. 

Times Microwave Systems has added two new 6 port entrance panels to its offering of the Times-Protect Smart-Panel, series, the most revolutionary concept in shelter and base station entrance panels to ever come along. Intelligently designed to eliminate traditional entrance panel shortcomings and vastly improve the protection of expensive base station equipment, the Smart-Panel® is truly a product for 21st century needs.

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 

Rache Corp. has developed a proprietary laser cutting process that can cut virtually all thin, ferrous metal and non-ferrous metal foils that range between .0005” to .060” thickness (.005 to .040 inches for aluminum, brass, and copper).

Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.

Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.

EAM's low loss cable assemblies provide the highest level of electrical performance for applications requiring extremely low attenuation over a broad frequency range. By combining silver-plated copper center conductor, expanded PTFE tape dielectric, aluminum polyester or polymide tape, silver-plated copper outer braid, and FEP jacket, these low loss cable assemblies achieve outstanding electrical characteristics to 18 GHz.