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Insulectro, a leading supplier of materials for use in the PCB and printed electronics industries, announced a breakthrough partnership to supply world-class performance copper foils manufactured by Oak-Mitsui throughout North America.
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Crystek has extended the frequency range of its high performance RF coaxial cable assemblies to 50 GHz. The new 50 GHz low-loss RF cable assemblies feature corrosion-resistant 2.4 mm 303 stainless steel connectors and three levels of shielding for low attenuation (loss) over distance (1.44 dB/ft. at 50 GHz). They are in stock in standard lengths of 24", 39.4" and 48", with custom lengths available.
The new AT549RBT cored-spring inductor from Coilcraft CPS (Critical Products & Services) features a temperature rating of -55° to +300°C, making it ideal for extreme-temperature applications such as down-hole drilling and on-engine automotive.
Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that it has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.
Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards, announced it had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products.
Common coaxial cables could be made 50 percent lighter with a new nanotube-based outer conductor developed by Rice University scientists.
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Rogers Corp.’s Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials