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NXP Semiconductors has appointed Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China, who will be based in Shanghai.
NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.
NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.
NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.
NXP Semiconductors has launched its new Gen8+ LDMOS RF power transistors – an expansion of its eighth-generation LDMOS product line for wireless base stations with a strong focus on TD-LTE.
NXP Semiconductors has introduced a groundbreaking family of programmable AISG transceivers for wireless base stations and antenna line devices such as tower-mounted amplifiers and remote electric tilt antennas.
NXP Semiconductors and Audi have signed a strategic partnership for innovation that focuses on innovation speed and time to market in eight selected automotive electronics application segments.
Identive Group Inc. and NXP Semiconductors N.V. are providing innovative near field communication (NFC) payment tags to Yeldi Softcom Pvt Ltd to support the launch of its ‘ara eTap’ cashless payment application in India.