Articles Tagged with ''test''

The testing of novel future generation communication systems, next-generation wireless communication and electronically steerable antennae were just three initiatives honoured at the annual National Instruments UK & Ireland Graphical System Design Achievement Awards.

Tektronix Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, introduced the MDO4000B series of mixed domain oscilloscopes that features significantly enhanced spectrum analyzer performance and, when used with Tektronix SignalVu-PC, the industry’s widest bandwidth vector signal analysis capability and deep support for WLAN 802.11 a/b/g/j/n/p/ac testing.  

Anite has announced that its Conformance Toolset for protocol and performance testing supports the highest number of validated protocol conformance test cases for TD-LTE.

Rohde & Schwarz and NTT DOCOMO have joined forces to develop an interoperability test package. NTT DOCOMO has now validated the package as NTT DOCOMO approved test equipment.

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 

Rohde & Schwarz and HiSilicon have successfully implemented the requirements for device category 6 in compliance with 3GPP Release 10 for LTE-Advanced.

Anritsu Co. announces its market-leading ME7873L RF/RRM Conformance Test System and ME7834L Mobile Device Test Platform have received the most test case validations across a single platform type for LTE-Advanced Carrier Aggregation (CA). This breakthrough further affirms Anritsu’s commitment to provide solutions for certification testing of mobile devices that implement CA, one of the key LTE-Advanced features defined in 3GPP Release 10.

Aeroflex Ltd. announced that the TM500 Test Mobile family now provides full-stack WCDMA handset simulation capability that is scalable from testing and verifying the performance of small cells right up to multi-handset, multi-cell network capacity performance testing.

Horizon House Publications and Microwave Journal China announced the lineup of Gold-level sponsors for next year’s Electronic Design Innovation Conference (EDI CON 2014). The Gold sponsors are Anritsu, CST, Spirent Communications, Mini-Circuits and Richardson RFPD.